Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.48 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.39 |
| ▸ | PDE4A | P27815 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.39 |
| ▸ | BLM | P54132 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27175673 | 0.97 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL564743 | 0.97 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL517829 | 0.97 | APP (0.50) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL565134 | 0.94 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL15297851 | 0.94 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL28042194 | 0.92 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL27175667 | 0.92 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL27175669 | 0.92 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL15297847 | 0.89 | APP (0.39) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL14856462 | 0.87 | TDP1 (0.48) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 180 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114086223-A | Preparation method of acid bath, copper deposit and plating homogenizing agent | 永星化工(上海)有限公司 | 2022-02-25 | — | — | CN | claimed |
| CN-112899736-A | PCB high-longitudinal-transverse-through-hole electro-coppering additive and preparation method thereof | 深圳中科利尔科技有限公司 | 2021-06-04 | — | — | CN | claimed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | claimed |
| EP-2576867-B1 | METHOD FOR ETCHING SURFACES OF CIRCUIT STRUCTURES OF PLATED COPPER AND PLATED COPPER ALLOYS | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-04-04 | — | — | EP | claimed |
| US-9493886-B2 | Low internal stress copper electroplating method | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-11-15 | — | — | US | claimed |
| EP-3088570-A2 | ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTILITY COPPER DEPOSITS | Rohm and Haas Electronic Materials LLC (US) | 2016-11-02 | — | — | EP | claimed |
| US-20160312372-A1 | ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTIILITY COPPER DEPOSITS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-10-27 | — | — | US | claimed |
| US-20130240368-A1 | LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD | ROHM AND HAAS ELECTRONIC MATERIAL LLC (US) | 2013-09-19 | — | — | US | claimed |
| US-20130112566-A1 | METHOD FOR ETCHING OF COPPER AND COPPER ALLOYS | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-05-09 | — | — | US | claimed |
| EP-2576867-A1 | METHOD FOR ETCHING OF COPPER AND COPPER ALLOYS | Atotech Deutschland GmbH (DE) | 2013-04-10 | — | — | EP | claimed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | claimed |
| US-20060017169-A1 | Electroplated interconnection structures on integrated circuit chips | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-01-26 | — | — | US | claimed |
| US-6946716-B2 | Electroplated interconnection structures on integrated circuit chips | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-20 | — | — | US | claimed |
| US-20040229456-A1 | Electroplated interconnection structures on integrated circuit chips | INTERNATIONAL BUSINESS MACHINES (US) | 2004-11-18 | — | — | US | claimed |
| US-6709562-B1 | VOID-FREE AND SEAMLESS; COPPER IS SUPERIOR TO THE ELECTROMIGRATION RESISTANCE OF ALCU | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-03-23 | — | — | US | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0932913-A1 | ELECTROPLATED INTERCONNECTION STRUCTURES ON INTEGRATED CIRCUIT CHIPS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-04 | — | — | EP | claimed |
| WO-1998027585-A1 | ELECTROPLATED INTERCONNECTION STRUCTURES ON INTEGRATED CIRCUIT CHIPS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1998-06-25 | — | — | WO | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |
| US-4181582-A | Galvanic acid copper bath and method | SCHERING AKTIENGESELLSCHAFT (DE) | 1980-01-01 | — | — | US | claimed |