⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Isopropyl Alcohol SCHEMBL30547885 | 0.94 | ALDH1A1 (0.86) | — | |
| Isopropyl Alcohol SCHEMBL17422610 | 0.88 | — | — | |
| Isopropyl Alcohol SCHEMBL18419254 | 0.88 | — | — | |
| Isopropyl Alcohol SCHEMBL22638753 | 0.88 | — | — | |
| Isopropyl Alcohol SCHEMBL6713255 | 0.88 | — | — | |
| Isopropyl Alcohol SCHEMBL27739743 | 0.88 | — | — | |
| Isopropyl Alcohol SCHEMBL768800 | 0.88 | ALDH1A1 (0.75) | — | |
| Isopropyl Alcohol SCHEMBL11660259 | 0.88 | — | — | |
| Isopropyl Alcohol SCHEMBL16914724 | 0.87 | — | — | |
| Isopropyl Alcohol SCHEMBL10729977 | 0.87 | ALDH1A1 (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20070256857-A1 | Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste | MITSUI MINING & SMELTING CO., LTD. (JP) | 2007-11-08 | — | — | US | claimed |
| EP-1804256-A1 | CONDUCTIVE PASTE AND FLEXIBLE PRINTED WIRING BOARD OBTAINED BY USING THE CONDUCTIVE PASTE | Mitsui Mining & Smelting Co., Ltd. (JP) | 2007-07-04 | — | — | EP | claimed |
| CN-109072004-B | Gel composition and water absorption preventive agent | 信越化学工业株式会社 | 2021-03-23 | — | — | CN | disclosed |
| CN-106414063-B | Gas barrier film and electronic device using same | 柯尼卡美能达株式会社 | 2018-09-11 | — | — | CN | disclosed |
| CN-106414063-A | GAS BARRIER FILM AND ELECTRONIC DEVICE USING SAME | 柯尼卡美能达株式会社 | 2017-02-15 | — | — | CN | disclosed |
| US-20160186009-A1 | GAS BARRIER FILM | Konica Minolta, Inc. (JP) | 2016-06-30 | — | — | US | disclosed |
| US-20160153089-A1 | GAS BARRIER FILM, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC DEVICE USING THE SAME | Konica Minolta, Inc. (JP) | 2016-06-02 | — | — | US | disclosed |
| US-20160108282-A1 | GAS BARRIER FILM AND METHOD FOR PRODUCING THE SAME | Konica Minolta, Inc. (JP) | 2016-04-21 | — | — | US | disclosed |
| EP-2533254-B1 | REDUCING AGENT COMPOSITION FOR CONDUCTIVE METAL PASTE | NAMICS CORP (JP) | 2015-11-04 | — | — | EP | disclosed |
| CN-104053721-A | Resin composition | AJINOMOTO KK | 2014-09-17 | — | — | CN | disclosed |
| CN-103890088-A | Resin composition | AJINOMOTO KK | 2014-06-25 | — | — | CN | disclosed |
| US-20120298929-A1 | REDUCING AGENT COMPOSITION FOR THE CONDUCTIVE METAL PASTE | NAMICS CORPORATION (JP) | 2012-11-29 | — | — | US | disclosed |
| CN-102540713-A | Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, and process for making relief printing plate | FUJIFILM CORP | 2012-07-04 | — | — | CN | disclosed |
| CN-101925651-A | Hydrophilic composition having mildewproofing effect and hydrophilic member | FUJIFILM CORP | 2010-12-22 | — | — | CN | disclosed |
| CN-1946795-B | Dual-stage wafer applied underfills | LORD CORP | 2010-06-23 | — | — | CN | disclosed |
| CN-101679807-A | Hydrophilic coating composition and hydrophilic member using the same | FUJIFILM CORP | 2010-03-24 | — | — | CN | disclosed |
| US-20070256857-A1 | Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste | MITSUI MINING & SMELTING CO., LTD. (JP) | 2007-11-08 | — | — | US | disclosed |
| EP-1804256-A1 | CONDUCTIVE PASTE AND FLEXIBLE PRINTED WIRING BOARD OBTAINED BY USING THE CONDUCTIVE PASTE | Mitsui Mining & Smelting Co., Ltd. (JP) | 2007-07-04 | — | — | EP | disclosed |
| CN-1946795-A | Dual-stage wafer applied underfills | LORD CORP (US) | 2007-04-11 | — | — | CN | disclosed |
| CN-1831182-A | Nanometer slurry plasma spraying method | IRON & STEEL RES GEN ACADEMY (CN) | 2006-09-13 | — | — | CN | disclosed |