SCHEMBL5229243

SCHEMBL5229243

C=C(C)C(=O)OCCOc1ccc(C(C)(C)c2ccc(O)cc2)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.51
HTT P42858 2/20 0.51
TDP1 Q9NUW8 2/20 0.51
APEX1 P27695 1/20 0.51
KDM4E B2RXH2 9/20 0.44
AR P10275 2/20 0.43
ESR1 P03372 1/20 0.43
CYP3A4 P08684 1/20 0.43
HPGD P15428 1/20 0.43
TSHR P16473 1/20 0.43
SLC6A2 P23975 1/20 0.43
SLC6A4 P31645 1/20 0.43
HTR6 P50406 1/20 0.43
ESRRG P62508 1/20 0.43
SLC6A3 Q01959 1/20 0.43
ESR2 Q92731 1/20 0.43
HSD17B10 Q99714 1/20 0.43
ALDH1A1 P00352 7/20 0.43
MEN1 O00255 3/20 0.43
KMT2A Q03164 3/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL59813 0.94 POLB (0.56) POLBHTTTDP1APEX1KDM4E
SCHEMBL14173142 0.94 POLB (0.56) POLBHTTTDP1APEX1KDM4E
Propane SCHEMBL9476274 0.92 HTT (0.53) POLBHTTTDP1APEX1KDM4E
SCHEMBL31351511 0.90 POLB (0.52) POLBHTTTDP1APEX1KDM4E
SCHEMBL4453444 0.90 POLB (0.52) POLBHTTTDP1APEX1KDM4E
Methacrylic Acid SCHEMBL4236287 0.90 POLB (0.56) POLBHTTTDP1APEX1KDM4E
SCHEMBL11965797 0.90 POLB (0.52) POLBHTTTDP1APEX1KDM4E
SCHEMBL19770676 0.90 POLB (0.52) POLBHTTTDP1APEX1KDM4E
SCHEMBL4580087 0.90 POLB (0.60) POLBHTTTDP1APEX1TSHR
SCHEMBL14749610 0.90 POLB (0.49) POLBHTTTDP1APEX1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1840654-B1 Radiation-sensitive negative resin composition JSR CORP (JP) 2013-03-20 EP disclosed
EP-1477848-B1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2012-12-05 EP disclosed
US-20070237890-A1 Bilayer Laminated Film for Bump Formation and Method of Bump Formation JSR CORPORATION (JP) 2007-10-11 US disclosed
US-20070231747-A1 Radiation-sensitive negative resin composition JSR CORPORATION (JP) 2007-10-04 US disclosed
EP-1840654-A1 Radiation-sensitive negative resin composition JSR Corporation (JP) 2007-10-03 EP disclosed
US-7265044-B2 Method for forming bump on electrode pad with use of double-layered film JSR CORPORATION (JP) 2007-09-04 US disclosed
EP-1826612-A1 Radiation-sensitive positive resin composition for producing platings, transfer film, and process for producing platings JSR Corporation (JP) 2007-08-29 EP disclosed
US-20070196765-A1 RADIATION-SENSITIVE POSITIVE RESIN COMPOSITION FOR PRODUCING PLATINGS, TRANSFER FILM, AND PROCESS FOR PRODUCING PLATINGS JSR CORPORATION (JP) 2007-08-23 US disclosed
EP-1739487-A1 BILAYER LAMINATED FILM FOR BUMP FORMATION AND METHOD OF BUMP FORMATION JSR Corporation (JP) 2007-01-03 EP disclosed
US-7141355-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-11-28 US disclosed
US-20050277245-A1 Method for forming bump on electrode pad with use of double-layered film JSR CORPORATION (JP) 2005-12-15 US disclosed
EP-1542520-A1 METHOD FOR FORMING BUMP ON ELECTRODE PAD WITH USE OF DOUBLE-LAYERED FILM JSR Corporation (JP) 2005-06-15 EP disclosed
EP-1477848-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-11-17 EP disclosed
US-20040142280-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed