SCHEMBL5268599

SCHEMBL5268599

CCCCCCCCCCCCOCC(O)COC(C)CO

nearest known ligand 0.69

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
USP2 O75604 1/20 0.69
HTT P42858 2/20 0.57
LPAR5 Q9H1C0 4/20 0.54
SPHK1 Q9NYA1 1/20 0.53
TDP1 Q9NUW8 1/20 0.47
PLA2G2C Q5R387 1/20 0.46
CYP1A2 P05177 1/20 0.43
CYP3A4 P08684 1/20 0.43
CYP2C19 P33261 1/20 0.43
MEN1 O00255 1/20 0.43
THRB P10828 1/20 0.43
KMT2A Q03164 1/20 0.43
MAPT P10636 1/20 0.43
LPAR1 Q92633 7/20 0.42
LPAR3 Q9UBY5 7/20 0.42
LPAR2 Q9HBW0 4/20 0.42
HSD17B10 Q99714 1/20 0.41
LPAR6 P43657 3/20 0.40
LPAR4 Q99677 3/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5268818 0.97 USP2 (0.65) USP2HTTLPAR5SPHK1TDP1
SCHEMBL5268735 0.97 USP2 (0.65) USP2HTTLPAR5SPHK1TDP1
SCHEMBL6277233 0.95 USP2 (0.62) USP2HTTLPAR5SPHK1TDP1
SCHEMBL191722 0.93 USP2 (0.58) USP2HTTLPAR5SPHK1TDP1
SCHEMBL11436363 0.90 USP2 (0.54) USP2HTTLPAR5SPHK1TDP1
SCHEMBL1576197 0.90 USP2 (0.54) USP2HTTLPAR5SPHK1TDP1
SCHEMBL11431109 0.88 TDP1 (0.60) USP2HTTLPAR5SPHK1TDP1
Methacrylic Acid SCHEMBL11760428 0.85 USP2 (0.51) USP2HTTLPAR5SPHK1TDP1
SCHEMBL9813411 0.85 USP2 (0.71) USP2HTTLPAR5SPHK1PLA2G2C
SCHEMBL6276347 0.84 TDP1 (0.61) USP2HTTLPAR5SPHK1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240118612-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2024-04-11 US disclosed
US-20210311391-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED FORMED BODY, AND SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2021-10-07 US disclosed
WO-2020039755-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED FORMED BODY, AND SEMICONDUCTOR DEVICE JSR株式会社 2020-02-27 WO disclosed
US-10415011-B2 Adherend recovery method, adherend recovery apparatus, gas-generating film and resin composition JSR CORPORATION (JP) 2019-09-17 US disclosed
EP-3040411-B1 ADHEREND RECOVERY METHOD AND ADHEREND RECOVERY DEVICE JSR CORP (JP) 2019-07-03 EP disclosed
US-10095110-B2 Photosensitive resin composition, method for forming resist pattern, and method for producing metallic pattern JSR CORPORATION (JP) 2018-10-09 US disclosed
US-20170153543-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING METALLIC PATTERN JSR CORPORATION (JP) 2017-06-01 US disclosed
US-20170127533-A1 PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAMINATE, LAMINATE AND ELECTRONIC PART JSR CORPORATION (JP) 2017-05-04 US disclosed
EP-3040411-A1 ADHEREND RECOVERY METHOD, ADHEREND RECOVERY DEVICE, GAS GENERATION MEMBRANE, AND RESIN COMPOSITION JSR Corporation (JP) 2016-07-06 EP disclosed
US-20160168532-A1 ADHEREND RECOVERY METHOD, ADHEREND RECOVERY APPARATUS, GAS-GENERATING FILM AND RESIN COMPOSITION JSR CORPORATION (JP) 2016-06-16 US disclosed
EP-1840654-B1 Radiation-sensitive negative resin composition JSR CORP (JP) 2013-03-20 EP disclosed
EP-1840654-A1 Radiation-sensitive negative resin composition JSR Corporation (JP) 2007-10-03 EP disclosed