SCHEMBL530095

SCHEMBL530095

Cc1ccc2sc3ccccc3c(=O)c2c1C

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 6/20 0.63
ALDH1A1 P00352 5/20 0.63
MEN1 O00255 4/20 0.63
KMT2A Q03164 4/20 0.63
POLB P06746 3/20 0.63
GAA P10253 1/20 0.63
NPC1 O15118 3/20 0.55
RAB9A P51151 3/20 0.55
CYP1A2 P05177 2/20 0.55
CYP3A4 P08684 1/20 0.55
CYP2C9 P11712 1/20 0.55
HPGD P15428 1/20 0.55
CYP2C19 P33261 1/20 0.55
MAOA P21397 2/20 0.51
MAOB P27338 2/20 0.51
L3MBTL1 Q9Y468 3/20 0.47
KDM4E B2RXH2 2/20 0.47
TDP1 Q9NUW8 2/20 0.47
HCRTR1 O43613 1/20 0.45
LMNA P02545 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29402827 1.00 MAPT (0.63) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL30278834 0.85 GPR3 (0.50) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL421647 0.85 GPR3 (0.50) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL27558764 0.83 MAPT (0.64) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL28311473 0.83 MAPT (0.52) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL31379948 0.82 MAPT (0.58) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL425780 0.82 MAPT (0.58) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL21206936 0.82 MAPT (0.55) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL26194399 0.81 MAPT (0.75) MAPTALDH1A1MEN1KMT2APOLB
SCHEMBL22161850 0.81 NPC1 (0.74) MAPTALDH1A1MEN1KMT2APOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1453 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122080620-A Low-shrinkage photo-curing elastic resin composition based on synergistic compensation and application thereof 2026-05-26 CN claimed
CN-119264336-A Polybutadiene acrylate photosensitive resin composition with self-healing property and application thereof in 405nm photocuring 3D printing 福建农林大学 2025-01-07 CN claimed
CN-118931467-A High-adhesive-strength and high-water-resistance UV (ultraviolet) glue and preparation method thereof 河源然生新材料有限公司 2024-11-12 CN claimed
CN-118459686-A Photosensitive resin composition based on polybutadiene polyurethane acrylate and application of photosensitive resin composition in 405nm photocuring 3D printing 泉州师范学院 2024-08-09 CN claimed
CN-118192169-A Photo-thermal curing 3D printing photosensitive resin composition and printing method thereof at 405nm 杭州喜马拉雅信息科技有限公司 2024-06-14 CN claimed
CN-118126325-A Low-temperature-cured alkali-soluble photosensitive resin and preparation method thereof 深圳先进电子材料国际创新研究院 2024-06-04 CN claimed
CN-117866149-A Photosensitive resin composition based on ionic liquid and application of photosensitive resin composition in 405nm3D printing 福州大学 2024-04-12 CN claimed
CN-117844234-A Resin composition based on PSS-PEDOT waterborne polyurethane acrylate and application thereof 泉州师范学院 2024-04-09 CN claimed
CN-115197375-B Photosensitive resin composition suitable for 3D printing transparent elastomer and preparation method thereof 材翼新材料科技(苏州)有限公司 2024-04-02 CN claimed
CN-117720687-A Repairable polyurethane photosensitive resin composition and application thereof in 405nm photocuring 3D printing 泉州师范学院 2024-03-19 CN claimed
CN-109836537-A A kind of application based on anacardol photosensitive resin composition and its in 405nm 3D printing 泉州师范学院 2019-06-04 CN claimed
CN-104830159-A Preparation method and application of photo-curing color paste containing graphene UNIV QINGDAO SCIENCE & TECHNOLOGY 2015-08-12 CN claimed
CN-104817835-A Photosensitive resin composition and application thereof in three-dimensional printing FUJIAN MATTER STRUCTURE 2015-08-05 CN claimed
CN-104765251-A High-toughness photosensitive resin for 3D printing and preparation method thereof. UNIV QINGDAO SCIENCE & TECHNOLOGY 2015-07-08 CN claimed
US-8003292-B2 Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer INFINEON TECHNOLOGIES AG (DE) 2011-08-23 US claimed
US-5637395-A PHOTOCURABLE RUBBER OR ACRYL-BASED PRESSURE SENSITIVE ADHESIVE; THREE DIMENSIONAL NETWORK NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1997-06-10 US claimed
EP-0368327-B1 Light-sensitive composition FUJI PHOTO FILM CO LTD (JP) 1995-02-15 EP claimed
EP-0157508-B1 THIN ADHESIVE SHEET FOR USE IN WORKING SEMICONDUCTOR WAFERS NITTO DENKO CORPORATION (JP) 1992-07-15 EP claimed
EP-0368327-A2 Light-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 1990-05-16 EP claimed
EP-0157508-A2 Thin adhesive sheet for use in working semiconductor wafers NITTO DENKO CORPORATION (JP) 1985-10-09 EP claimed