SCHEMBL5313481

SCHEMBL5313481

C=COCCOCCOCC1CO1

nearest known ligand 0.54

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.54
ALDH1A1 P00352 5/20 0.53
SMN1; SMN2 Q16637 1/20 0.47
TDP1 Q9NUW8 1/20 0.44
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5312617 1.00 TSHR (0.54) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL27173978 1.00 TSHR (0.54) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL654164 0.98 TSHR (0.56) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL3370444 0.86 TSHR (0.69) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL27173979 0.86 TSHR (0.63) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL16593514 0.85 TSHR (0.67) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL28619547 0.85 TSHR (0.67) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL19971745 0.85 TSHR (0.67) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL16593670 0.85 TSHR (0.67) TSHRALDH1A1SMN1; SMN2TDP1MAPK1
SCHEMBL16593524 0.85 TSHR (0.67) TSHRALDH1A1SMN1; SMN2TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12515423-B2 Contact lens with a hydrogel coating thereon ALCON INC. (CH) 2026-01-06 US disclosed
US-12509612-B2 Adhesive composition, adhesive tape, and method for processing electronic component SEKISUI CHEMICAL CO., LTD. (JP) 2025-12-30 US disclosed
EP-4573397-A1 A CONTACT LENS WITH A HYDROGEL COATING THEREON Alcon Inc. (CH) 2025-06-25 EP disclosed
CN-113574083-B Adhesive composition, adhesive tape, and method for treating electronic component 积水化学工业株式会社 2025-06-10 CN disclosed
WO-2025058045-A1 ADHESIVE FILM, METHOD FOR PRODUCING ADHESIVE FILM, ADHESIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 積水化学工業株式会社 2025-03-20 WO disclosed
CN-115066474-B Adhesive composition, adhesive tape, and method for treating electronic component 积水化学工业株式会社 2025-01-03 CN disclosed
CN-112470318-B Electrolyte composition, electrolyte membrane, and method for producing electrolyte membrane 株式会社日本触媒 2024-08-16 CN disclosed
WO-2024154729-A1 ADHESIVE FILM, TEMPORARY FIXING MATERIAL, CURED PRODUCT, LAMINATE, AND METHOD OF PRODUCING ELECTRONIC COMPONENT 積水化学工業株式会社 2024-07-25 WO disclosed
US-12027666-B2 Electrolyte composition, electrolyte film, and method of manufacturing electrolyte film NIPPON SHOKUBAI CO., LTD. (JP) 2024-07-02 US disclosed
WO-2024135615-A1 ELECTROLYTE COMPOSITION, ELECTROLYTE CURED ARTICLE OBTAINED BY CURING SAME, ELECTRODE, AND SECONDARY BATTERY 株式会社日本触媒 2024-06-27 WO disclosed
EP-1327650-B1 Production process for ethylene oxide copolymer DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2007-08-08 EP disclosed
US-20050245410-A1 Water soluble nonionic alkylene oxide resin, and production process therefor DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2005-11-03 US disclosed
US-20050197485-A1 Process for production of ethylene oxide copolymer NIPPON SHOKUBAI CO., LTD. 2005-09-08 US disclosed
EP-1568726-A1 Process for production of ethylene oxide copolymer Nippon Shokubai Co., Ltd. (JP) 2005-08-31 EP disclosed
EP-1568728-A2 Water soluble non-ionic alkylene oxide resin and production process therefor Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2005-08-31 EP disclosed
US-6864353-B2 Production process for ethylene oxide copolymer DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2005-03-08 US disclosed
US-20030158374-A1 Production process for ethylene oxide copolymer DAI-ICHI KOGYO SEIYAKU CO., LTD. 2003-08-21 US disclosed
EP-1327650-A1 Production process for ethylene oxide copolymer Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2003-07-16 EP disclosed
CN-1054383-C Method for preparation of unregular formed polymer particles KAO CORP (JP) 2000-07-12 CN disclosed
CN-1084179-A The preparation method of unregular formed polymer particles SHIRO MOCHIZUKI (JP) 1994-03-23 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12509612-B2 Adhesive composition, adhesive tape, and method for processing electronic component ICAM1, MACF1, AFF1 TSHR 2723/4885ALDH1A1 554/4885SMN1; SMN2 1950/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.