⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Sulfurous Acid SCHEMBL28866201 | 1.00 | — | — | |
| Sulfurous Acid SCHEMBL9005155 | 0.94 | — | — | |
| Sulfurous Acid SCHEMBL36786 | 0.94 | — | — | |
| Sulfurous Acid SCHEMBL3390951 | 0.94 | CA1 (0.86) | — | |
| Sulfurous Acid SCHEMBL2424977 | 0.94 | CA1 (0.86) | — | |
| Sulfurous Acid SCHEMBL11325410 | 0.94 | CA1 (0.86) | — | |
| Sulfurous Acid SCHEMBL3388945 | 0.94 | — | — | |
| Sulfurous Acid SCHEMBL83301 | 0.94 | — | — | |
| Sulfurous Acid SCHEMBL5145215 | 0.94 | — | — | |
| Sulfurous Acid SCHEMBL721765 | 0.94 | CA1 (0.86) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 352 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115710701-B | Electroless gold plating solution and application | 广东东硕科技有限公司 | 2024-12-10 | — | — | CN | claimed |
| CN-118600498-A | Cyanide-free electroplating solution capable of electroplating soft gold and hard gold | 紫金矿业集团股份有限公司 | 2024-09-06 | — | — | CN | claimed |
| CN-118345460-A | Sulfite cyanide-free electroforming gold solution | 深圳市皇金品珠宝有限公司 | 2024-07-16 | — | — | CN | claimed |
| CN-117552063-A | Cyanide-free gold plating solution, method for plating gold on nickel layer, and gold-plated article | 光华科学技术研究院(广东)有限公司 | 2024-02-13 | — | — | CN | claimed |
| CN-116905054-A | Method for prolonging service life of cyanide-free gold plating solution | 厦门紫金新能源新材料科技有限公司 | 2023-10-20 | — | — | CN | claimed |
| CN-114703520-B | Cyanide-free electroplating gold liquid, preparation method and application thereof, gold-plated part and preparation method thereof | 深圳市联合蓝海黄金材料科技股份有限公司 | 2023-03-31 | — | — | CN | claimed |
| CN-115710701-A | Chemical gold plating solution and application | 广东东硕科技有限公司 | 2023-02-24 | — | — | CN | claimed |
| CN-114717618-B | Cyanide-free gold electroplating bath and application thereof, semiconductor gold-plated part and preparation method thereof | 深圳市联合蓝海黄金材料科技股份有限公司 | 2023-01-31 | — | — | CN | claimed |
| CN-115595634-A | Cyanide-free gold plating solution containing Ru coordination compound and gold plating method | 广东工业大学（CN） | 2023-01-13 | — | — | CN | claimed |
| CN-113699563-B | Production method of hard gold round ball | 深圳市联合蓝海黄金材料科技股份有限公司 | 2023-01-03 | — | — | CN | claimed |
| CN-101363128-A | Non-cyanogen type electrolytic gold plating bath for bump forming | CHEMCAT CORP E (JP) | 2009-02-11 | — | — | CN | claimed |
| CN-101235524-A | Non-cyanide electrolysis gold plating bath for gold bump and gold wiring | N E CHEMCAT CORP (JP) | 2008-08-06 | — | — | CN | claimed |
| CN-1944716-A | Non-cyanogen type electrolytic gold plating bath for bump forming | CHEMCAT CORP E (JP) | 2007-04-11 | — | — | CN | claimed |
| CN-1308493-C | Complex of ammonium thicoaurite and preparation process thereof | TENG XIANDI (CN) | 2007-04-04 | — | — | CN | claimed |
| CN-1940147-A | Formation method of gold bump or gold wiring | N E CHEMCAT CORPORAITON (JP) | 2007-04-04 | — | — | CN | claimed |
| CN-1598071-A | Complex of ammonium thicoaurite and preparation process thereof | TENG XIANDI (CN) | 2005-03-23 | — | — | CN | claimed |
| EP-1026285-A2 | Electroless gold plating solution and process | Shipley Company LLC (US) | 2000-08-09 | — | — | EP | claimed |
| EP-0618308-B1 | Electroless gold plating bath | UYEMURA C & CO LTD (JP) | 1998-06-17 | — | — | EP | claimed |
| US-4435253-A | CARBOXYLIC ACID ADDED TO MAINTAIN HARDNESS OF DEPOSIT | OMI INTERNATIONAL CORPORATION (US) | 1984-03-06 | — | — | US | claimed |
| US-4366035-A | Electrodeposition of gold alloys | ENGELHARD CORPORATION (US) | 1982-12-28 | — | — | US | claimed |