Sulfurous Acid

Sulfurous Acid

SCHEMBL83301

O=S(O)O.[Au]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1646 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122040938-A Leakage self-display all-metal bellows valve based on beta particle excitation fluorescence 中国工程物理研究院材料研究所 2026-05-15 CN claimed
US-20250283244-A1 SULFATE SALT DESALINATION FOR GOLD SULFITE PLATING SOLUTION ClassOne Technology 2025-09-11 US claimed
CN-119876926-B Chemical plating thick gold plating solution and method for chemically plating thick gold on LTCC copper-based material 深圳市海里表面技术处理有限公司 2025-06-10 CN claimed
CN-119876926-A Chemical plating thick gold plating solution and method for chemically plating thick gold on LTCC copper-based material 深圳市海里表面技术处理有限公司 2025-04-25 CN claimed
CN-119392325-A Cyanide-free gold plating solution for plating gold on micro blind holes and electroplating method 深圳创智芯联科技股份有限公司 2025-02-07 CN claimed
CN-119265552-A Chemical nickel-plating palladium-gold solution 生益电子股份有限公司 2025-01-07 CN claimed
CN-222251090-U Sulfite gold-plated anode device 广州超邦化工有限公司 2024-12-27 CN claimed
CN-119185365-A Micrometer motor and preparation method and application thereof 中山大学 2024-12-27 CN claimed
CN-119082813-A Plating solution for electroplating gold on nickel plating layer and application thereof 华为技术有限公司 2024-12-06 CN claimed
CN-119082814-A Stabilizer for cyanide-free gold plating and application thereof 重庆立道新材料科技有限公司 2024-12-06 CN claimed
US-5364460-A Gold and metal sulfite, reducing agent and organophosphonate; lemon yellow tone; corrosion resistance; nonspreading C. UYEMURA & CO., LTD. (JP) 1994-11-15 US claimed
EP-0618307-A1 Electroless gold plating bath C. UYEMURA & CO, LTD (JP) 1994-10-05 EP claimed
US-5232492-A Comprising a thiosulfate, a sulfite, a chelating agent and gold complexes consisted of gold sulfite, gold thiosulfate; stability, nontoxic APPLIED ELECTROLESS CONCEPTS INC. (US) 1993-08-03 US claimed
US-5147617-A Process for recovery of gold from gold ores using a complexing pretreatment and sulfurous acid leaching FREEPORT-MCMORAN INC. (US) 1992-09-15 US claimed
US-4717459-A Electrolytic gold plating solution SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) 1988-01-05 US claimed
US-4435253-A CARBOXYLIC ACID ADDED TO MAINTAIN HARDNESS OF DEPOSIT OMI INTERNATIONAL CORPORATION (US) 1984-03-06 US claimed
US-4366035-A Electrodeposition of gold alloys ENGELHARD CORPORATION (US) 1982-12-28 US claimed
US-4048023-A Electrodeposition of gold-palladium alloys OXY METAL INDUSTRIES CORPORATION (US) 1977-09-13 US claimed
US-3981782-A ALKALI METAL GOLD SULFITE, ALKALI METAL NITRITE JOHNSON MATTHEY & CO., LIMITED (EN) 1976-09-21 US claimed
US-3966880-A Method for producing alkali metal gold sulfite AMERICAN CHEMICAL & REFINING COMPANY INC. (US) 1976-06-29 US claimed