SCHEMBL5338720

SCHEMBL5338720

CCCO[SiH](C)C(C)OC

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14600508 0.77
SCHEMBL28994563 0.68
SCHEMBL27970927 0.65
SCHEMBL1322873 0.64
SCHEMBL309363 0.64
SCHEMBL28994588 0.64
SCHEMBL8603610 0.64 HSD17B10 (0.32) HSD17B10
SCHEMBL706280 0.64 HSD17B10 (0.35) HSD17B10
SCHEMBL1608792 0.64
SCHEMBL17075375 0.63 HSD17B10 (0.31) HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7238462-B2 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-03 US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 US disclosed