Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 1/20 | 0.47 |
| ▸ | HPGD | P15428 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | HTT | P42858 | 1/20 | 0.47 |
| ▸ | RAB9A | P51151 | 1/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.47 |
| ▸ | TYR | P14679 | 2/20 | 0.41 |
| ▸ | ALOX5 | P09917 | 4/20 | 0.39 |
| ▸ | EGFR | P00533 | 1/20 | 0.38 |
| ▸ | PTGS2 | P35354 | 6/20 | 0.38 |
| ▸ | SHBG | P04278 | 1/20 | 0.38 |
| ▸ | DHFR | P00374 | 1/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | PKM | P14618 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | MAOA | P21397 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10903188 | 0.93 | TYR (0.50) | HTTTYRALOX5PTGS2CYP3A4 | |
| SCHEMBL10904845 | 0.93 | TYR (0.50) | HTTTYRALOX5PTGS2CYP3A4 | |
| SCHEMBL10904635 | 0.93 | TYR (0.50) | HTTTYRALOX5PTGS2CYP3A4 | |
| SCHEMBL10902868 | 0.93 | TYR (0.50) | HTTTYRALOX5PTGS2CYP3A4 | |
| SCHEMBL10905749 | 0.93 | TYR (0.50) | HTTTYRALOX5PTGS2CYP3A4 | |
| SCHEMBL10904601 | 0.90 | TYR (0.47) | HTTTYRALOX5PTGS2DHFR | |
| SCHEMBL5431340 | 0.89 | DHFR (0.46) | NPC1HPGDMAPK1HTTRAB9A | |
| SCHEMBL24592640 | 0.89 | NPC1 (0.41) | NPC1HPGDMAPK1HTTRAB9A | |
| SCHEMBL10902745 | 0.89 | TYR (0.46) | HTTTYRALOX5PTGS2DHFR | |
| SCHEMBL12456937 | 0.88 | NPC1 (0.45) | NPC1HPGDMAPK1HTTRAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3058042-B1 | COMPOSITION | SI GROUP SWITZERLAND CHAA GMBH (CH) | 2020-03-11 | — | — | EP | claimed |
| EP-4253481-B1 | POLYPHENYLENE SULFIDE RESIN COMPOSITION AND MOLDED ARTICLE | TORAY INDUSTRIES (JP) | 2025-04-30 | — | — | EP | disclosed |
| US-20240376312-A1 | POLYAMIDE COMPOSITION | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-11-14 | — | — | US | disclosed |
| EP-4079812-B1 | FIBER-REINFORCED RESIN MOLDING MATERIAL, FIBER-REINFORCED RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING FIBER-REINFORCED RESIN MOLDED ARTICLE | TORAY INDUSTRIES (JP) | 2024-08-21 | — | — | EP | disclosed |
| US-20230407090-A1 | POLYPHENYLENE SULFIDE RESIN COMPOSITION AND MOLDED ARTICLE | TORAY INDUSTRIES, INC. (JP) | 2023-12-21 | — | — | US | disclosed |
| EP-3260500-B1 | POLYAMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE | ASAHI CHEMICAL IND (JP) | 2023-11-08 | — | — | EP | disclosed |
| EP-4253481-A1 | POLYPHENYLENE SULFIDE RESIN COMPOSITION AND MOLDED ARTICLE | Toray Industries, Inc. (JP) | 2023-10-04 | — | — | EP | disclosed |
| WO-2023135890-A1 | EPOXY RESIN COMPOSITION, DECORATIVE MATERIAL FOR JOINTS, AND METHODS OF USE FOR SAME | 三菱瓦斯化学株式会社 | 2023-07-20 | — | — | WO | disclosed |
| WO-2023033043-A1 | POLYAMIDE COMPOSITION | 旭化成株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-20220403122-A1 | FIBER-REINFORCED RESIN MOLDING MATERIAL, FIBER-REINFORCED RESIN MOLDED ARTICLE, AND METHOD OF MANUFACTURING FIBER-REINFORCED RESIN MOLDED ARTICLE | TORAY INDUSTRIES, INC. (JP) | 2022-12-22 | — | — | US | disclosed |
| US-20050271427-A1 | Developing method for an image forming apparatus and developing device using the same | ENOKI SHIGEKAZU | 2005-12-08 | — | — | US | disclosed |
| US-20030185599-A1 | Developing method for an image forming apparatus and developing device using the same | RICOH COMPANY, LTD. (JP) | 2003-10-02 | — | — | US | disclosed |
| EP-1333335-A2 | Developing method for an image forming apparatus and developing device using the same | Ricoh Company, Ltd. (JP) | 2003-08-06 | — | — | EP | disclosed |
| EP-0738933-B1 | Photosensitive member and method of producing the same | MITSUBISHI ELECTRIC CORP (JP) | 2000-09-06 | — | — | EP | disclosed |
| US-5834147-A | ELECTRICALLY CONDUCTIVE SUPPORT, PHOTOSENSITIVE LAYER INCLUDING DISPERSION-INSTABLE RESIN BINDER AND DISPERSED PHOTOCONDUCTIVE PHTHALOCYANINE COMPOUND PARTICLES SURFACE COATED WITH HYDROXYL GROUP-CONTAINING POLYMER | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1998-11-10 | — | — | US | disclosed |
| EP-0738933-A1 | Photosensitive member and method of producing the same | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1996-10-23 | — | — | EP | disclosed |
| EP-0592870-A1 | Process for preparing functionally coated expanded products from expandable tubing and the expanded products produced thereby | C.R. BARD, INC. (US) | 1994-04-20 | — | — | EP | disclosed |
| EP-0489050-A1 | ARYL ESTER AMIDE HALIDES OF PHOSPHONOUS ACID, ARYL ESTER AMIDES OF PHOSPHONOUS ACID, PROCESS FOR PREPARING THEM AND THEIR USE TO STABILIZE PLASTICS | HOECHST AKTIENGESELLSCHAFT (DE) | 1992-06-10 | — | — | EP | disclosed |
| WO-1991002738-A1 | ARYL ESTER AMIDE HALIDES OF PHOSPHONOUS ACID, ARYL ESTER AMIDES OF PHOSPHONOUS ACID, PROCESS FOR PREPARING THEM AND THEIR USE TO STABILIZE PLASTICS | HOECHST AKTIENGESELLSCHAFT (DE) | 1991-03-07 | — | — | WO | disclosed |
| US-4469835-A | Connector member adapted for ultraviolet antimicrobial irradiation | BAXTER TRAVENOL LABORATORIES, INC. (US) | 1984-09-04 | — | — | US | disclosed |