SCHEMBL5372884

SCHEMBL5372884

Cc1ccc2c3c(cccc13)CC2

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TYMS P04818 1/20 0.65
ALDH1A1 P00352 10/20 0.57
KDM4E B2RXH2 9/20 0.57
HPGD P15428 8/20 0.57
LMNA P02545 4/20 0.57
MEN1 O00255 3/20 0.57
GAA P10253 3/20 0.57
KMT2A Q03164 3/20 0.57
MAPT P10636 2/20 0.57
HSD17B10 Q99714 3/20 0.49
CYP3A4 P08684 2/20 0.48
ALOX15 P16050 1/20 0.48
POLB P06746 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
ATM Q13315 1/20 0.47
HTT P42858 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
CYP1A2 P05177 2/20 0.46
CYP2A6 P11509 1/20 0.46
TSHR P16473 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13726109 0.79 TYMS (1.00) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL10615508 0.78 TYMS (0.44) TYMSALDH1A1KDM4EHPGDLMNA
Hydrochloric Acid SCHEMBL10616509 0.77 TYMS (0.42) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL10615480 0.75 HTR2A (0.42) TYMS
SCHEMBL3298420 0.75 TYMS (0.45) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL10618323 0.75 TYMS (0.41) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL8434374 0.74 TYMS (0.43) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL5368108 0.73 KDM4E (0.57) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL13384865 0.73 ALDH1A1 (0.57) TYMSALDH1A1KDM4EHPGDLMNA
SCHEMBL5376037 0.73 HPGD (0.57) ALDH1A1KDM4EHPGDLMNAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113518789-B Resin composition, and prepreg, resin-equipped film, resin-equipped metal foil, metal-clad laminate and wiring board using the same 松下知识产权经营株式会社 2024-08-06 CN disclosed
CN-117720787-A Flexible metal clad laminate and method of making the same 科腾聚合物荷兰有限责任公司 2024-03-19 CN disclosed
CN-112020523-B Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-10-24 CN disclosed
US-20070248911-A1 Pattern forming method and bilayer film IWASAWA HARUO 2007-10-25 US disclosed
US-7244549-B2 Pattern forming method and bilayer film JSR CORPORATION (JP) 2007-07-17 US disclosed
US-20030073040-A1 Pattern forming method and bilayer film JSR CORPORATION (JP) 2003-04-17 US disclosed