SCHEMBL5372908

SCHEMBL5372908

O=C(O)c1cc2c3c(cccc3c1)C=C2

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MEN1 O00255 1/20 0.63
▸ KMT2A Q03164 1/20 0.63
▸ PTPN1 P18031 1/20 0.43
▸ CA12 O43570 2/20 0.42
▸ CA1 P00915 2/20 0.42
▸ CA2 P00918 2/20 0.42
▸ CA9 Q16790 2/20 0.42
▸ CA6 P23280 1/20 0.42
▸ RNASEH1 O60930 1/20 0.40
▸ PTPN11 Q06124 1/20 0.40
▸ GPR35 Q9HC97 1/20 0.40
▸ ATG4B Q9Y4P1 1/20 0.40
▸ MGAM O43451 1/20 0.40
▸ CA7 P43166 1/20 0.39
▸ CA14 Q9ULX7 1/20 0.39
▸ PSMD14 O00487 1/20 0.38
▸ PKM P14618 1/20 0.37
▸ L3MBTL1 Q9Y468 1/20 0.37
▸ TSHR P16473 2/20 0.37
▸ DAO P14920 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5372977 0.84 KMT2A (0.43) MEN1KMT2AHPGD
Hydrochloric Acid SCHEMBL8499722 0.82 PARP1 (0.43) MEN1KMT2APTPN11PSMD14L3MBTL1
SCHEMBL20744936 0.80 MEN1 (0.49) MEN1KMT2APTPN1CA12CA1
SCHEMBL8766190 0.80 CA12 (0.46) MEN1KMT2ACA12CA1CA2
SCHEMBL1901737 0.78 MEN1 (1.00) MEN1KMT2APTPN1CA12CA1
SCHEMBL2474711 0.77 MEN1 (0.53) MEN1KMT2APTPN1CA12CA1
SCHEMBL23292914 0.76 MEN1 (0.40) MEN1KMT2A
SCHEMBL9239387 0.75 MEN1 (0.50) MEN1KMT2APTPN1CA12CA1
SCHEMBL10012128 0.73 MEN1 (0.68) MEN1KMT2APTPN1CA12CA1
SCHEMBL1403567 0.73 MEN1 (0.82) MEN1KMT2ACA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3067897-B1 CONDUCTIVE MATERIAL AND SUBSTRATE SHINETSU CHEMICAL CO (JP) 2020-05-27 — — EP disclosed
EP-3153553-B1 CONDUCTIVE POLYMER COMPOSITION, COATED ARTICLE, AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2019-05-01 — — EP disclosed
EP-2947126-B1 CONDUCTIVE POLYMER COMPOSITE AND SUBSTRATE SHINETSU CHEMICAL CO (JP) 2019-02-13 — — EP disclosed
US-10023752-B2 Conductive material and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-07-17 — — US disclosed
US-10020089-B2 Conductive polymer composite and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-07-10 — — US disclosed
US-9991019-B2 Conductive polymer composite and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-06-05 — — US disclosed
US-20180134860-A1 STRETCHABLE FILM, METHOD FOR FORMING THE SAME, STRETCHABLE WIRING FILM, AND METHOD FOR MANUFACTURING THE SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-17 — — US disclosed
US-9922747-B2 Conductive material and substrate SHIN-ETSU HANDOTAI CO., LTD. (JP) 2018-03-20 — — US disclosed
US-9916916-B2 Conductive material and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-13 — — US disclosed
US-9897917-B2 Conductive polymer composition, coated article, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-20 — — US disclosed
US-20100159392-A1 PATTERNING PROCESS AND RESIST COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-24 — — US disclosed
CN-101541811-A Pyrazolopyrimidine Derivatives DAIICHI SANKYO CO LTD (JP) 2009-09-23 — — CN disclosed
US-20070248911-A1 Pattern forming method and bilayer film IWASAWA HARUO 2007-10-25 — — US disclosed
US-7244549-B2 Pattern forming method and bilayer film JSR CORPORATION (JP) 2007-07-17 — — US disclosed
US-6852791-B2 Anti-reflection coating forming composition JSR CORPORATION (JP) 2005-02-08 — — US disclosed
EP-1205805-B1 Anti-reflection coating forming composition JSR CORP (JP) 2004-09-15 — — EP disclosed
US-20030073040-A1 Pattern forming method and bilayer film JSR CORPORATION (JP) 2003-04-17 — — US disclosed
US-20020086934-A1 Anti-reflection coating forming composition JSR CORPORATION (JP) 2002-07-04 — — US disclosed
EP-1205805-A1 Anti-reflection coating forming composition JSR Corporation (JP) 2002-05-15 — — EP disclosed
US-4816519-A VULCANIZABLE RUBBER BLEND, MOLDING MATERIALS NIPPON ZEON CO., LTD. (JP) 1989-03-28 — — US disclosed
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