SCHEMBL5404074

SCHEMBL5404074

CC(SCC1CS1)SCC1CS1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18389763 0.84
SCHEMBL2770242 0.81
SCHEMBL1402667 0.80
SCHEMBL5072428 0.78
SCHEMBL1402528 0.77
SCHEMBL1094045 0.75
SCHEMBL5211985 0.74
SCHEMBL5205408 0.74
SCHEMBL18687285 0.73
SCHEMBL1402869 0.72 ROCK2 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240117100-A1 POLYMERIZABLE COMPOSITION, RESIN, FORMED BODY, OPTICAL MATERIAL, AND LENS MITSUI CHEMICALS, INC. (JP) 2024-04-11 US disclosed
WO-2024024918-A1 POLYMERIZABLE COMPOSITION, RESIN, MOLDED ARTICLE, OPTICAL MATERIAL, AND LENS 三井化学株式会社 2024-02-01 WO disclosed
EP-4289881-A1 POLYMERIZABLE COMPOSITION, RESIN, MOLDED ARTICLE, OPTICAL MATERIAL, AND LENS Mitsui Chemicals, Inc. (JP) 2023-12-13 EP disclosed
US-11608316-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-03-21 US disclosed
US-11414382-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2022-08-16 US disclosed
US-20210002216-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2021-01-07 US disclosed
US-20200392079-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2020-12-17 US disclosed
CN-110475796-A Composition for optical material MITSUBISHI GAS CHEMICAL CO 2019-11-19 CN disclosed
US-20180370908-A1 NOVEL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPRISING SAID COMPOUND, AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID PHOTOPOLYMERIZATION INITIATOR TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2018-12-27 US disclosed
EP-2540761-B1 CURABLE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2016-08-31 EP disclosed
US-8853346-B2 Curable resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-10-07 US disclosed
US-20130018168-A1 CURABLE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-01-17 US disclosed
EP-2540761-A1 CURABLE RESIN COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2013-01-02 EP disclosed
US-7300747-B2 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-11-27 US disclosed
EP-1564255-B1 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL CO (JP) 2007-09-26 EP disclosed
US-20050181300-A1 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-08-18 US disclosed
EP-1564255-A1 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-08-17 EP disclosed