⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL433806 | 0.84 | — | — | |
| SCHEMBL28794132 | 0.78 | — | — | |
| SCHEMBL1608795 | 0.76 | — | — | |
| SCHEMBL1607699 | 0.75 | LMNA (0.33) | — | |
| SCHEMBL8667499 | 0.73 | — | — | |
| SCHEMBL1608626 | 0.72 | — | — | |
| SCHEMBL22654153 | 0.72 | — | — | |
| SCHEMBL10923664 | 0.70 | — | — | |
| SCHEMBL3713143 | 0.69 | — | — | |
| SCHEMBL3921407 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-11377522-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| EP-3971229-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-23 | — | — | EP | disclosed |
| WO-2022054912-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | 三菱ケミカル株式会社 | 2022-03-17 | — | — | WO | disclosed |
| EP-3318606-B1 | SILICON-CONTAINING RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2020-03-18 | — | — | EP | disclosed |
| EP-3330320-B1 | POLYIMIDE PRECURSOR COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-04-24 | — | — | EP | disclosed |
| US-20180223045-A1 | POLYIMIDE PRECURSOR COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-08-09 | — | — | US | disclosed |
| US-20180187010-A1 | SILICON-CONTAINING RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-05 | — | — | US | disclosed |
| EP-3330320-A1 | POLYIMIDE PRECURSOR COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-06-06 | — | — | EP | disclosed |
| EP-3318606-A1 | SILICON-CONTAINING RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-05-09 | — | — | EP | disclosed |
| US-7175883-B2 | Polysiloxane sols method for the production and use thereof | BASF COATINGS AG (DE) | 2007-02-13 | — | — | US | disclosed |
| US-20050090635-A1 | Polysiloxane sols method for the production and use thereof | BASF CORPORATION | 2005-04-28 | — | — | US | disclosed |
| US-6828381-B1 | For producing coated substrates, especially coated automobile bodies | BASF COATINGS AG (DE) | 2004-12-07 | — | — | US | disclosed |
| US-6713559-B1 | POLYMER HAVING AT LEAST ACRYLATES WITH AND WITHOUT HYDROXYL FUNCTIONALITY AND ACRYLIC ACID MONOMERS, METAL ALKOXIDE AND HYDROLYZABLE SILOXANE COMPONENT; MAR RESISTANCE | BASF COATINGS AG (DE) | 2004-03-30 | — | — | US | disclosed |