SCHEMBL5406825

SCHEMBL5406825

C(CC1CS1)SSCCC1CS1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4998493 0.81
SCHEMBL4646867 0.79
SCHEMBL634945 0.73
SCHEMBL7627568 0.69
SCHEMBL8554213 0.65
SCHEMBL1276561 0.62
SCHEMBL4645016 0.60
SCHEMBL13765143 0.59
SCHEMBL14392602 0.59
SCHEMBL1275536 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250002653-A1 EPISULFIDE COMPOSITION, POLYMERIZABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MATERIAL MITSUI CHEMICALS, INC. (JP) 2025-01-02 US disclosed
EP-4397693-A1 EPISULFIDE COMPOSITION, POLYMERIZABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MATERIAL Mitsui Chemicals, Inc. (JP) 2024-07-10 EP disclosed
US-11608316-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-03-21 US disclosed
WO-2023032598-A1 EPISULFIDE COMPOSITION, POLYMERIZABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MATERIAL 三井化学株式会社 2023-03-09 WO disclosed
US-11414382-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2022-08-16 US disclosed
US-20210002216-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2021-01-07 US disclosed
US-20200392079-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2020-12-17 US disclosed
CN-111465593-A Novel compound, photopolymerization initiator containing the compound, and photosensitive resin composition containing the photopolymerization initiator 日本化药株式会社 2020-07-28 CN disclosed
US-20180370908-A1 NOVEL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPRISING SAID COMPOUND, AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID PHOTOPOLYMERIZATION INITIATOR TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2018-12-27 US disclosed
EP-2540761-B1 CURABLE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2016-08-31 EP disclosed
CN-102791771-B Curable resin composition MITSUBISHI GAS CHEMICAL CO 2014-12-10 CN disclosed
US-8853346-B2 Curable resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-10-07 US disclosed
US-20130018168-A1 CURABLE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-01-17 US disclosed
EP-2540761-A1 CURABLE RESIN COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2013-01-02 EP disclosed
CN-102791771-A Curable resin composition MITSUBISHI GAS CHEMICAL CO 2012-11-21 CN disclosed
US-7300747-B2 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-11-27 US disclosed
EP-1564255-B1 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL CO (JP) 2007-09-26 EP disclosed
US-20050181300-A1 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-08-18 US disclosed
EP-1564255-A1 Photobase generator and curable composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-08-17 EP disclosed