⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9784973 | 0.94 | — | — | |
| SCHEMBL3822761 | 0.94 | — | — | |
| SCHEMBL11298856 | 0.94 | — | — | |
| SCHEMBL9614296 | 0.94 | — | — | |
| SCHEMBL1811352 | 0.88 | — | — | |
| Water SCHEMBL665426 | 0.88 | — | — | |
| SCHEMBL28425881 | 0.88 | — | — | |
| SCHEMBL9785067 | 0.88 | — | — | |
| SCHEMBL11676555 | 0.88 | — | — | |
| SCHEMBL28406930 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4880567-A | MULTILAYER CIRCUITS, GLASS FRITS | GENERAL ELECTRIC COMPANY (US) | 1989-11-14 | — | — | US | claimed |
| US-4874550-A | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1989-10-17 | — | — | US | claimed |
| US-4816615-A | MIXTURE OF COPPER POWDER, GLASS FRIT AND ADHESION PROMOTER | GENERAL ELECTRIC COMPANY (US) | 1989-03-28 | — | — | US | claimed |
| US-4808770-A | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1989-02-28 | — | — | US | claimed |
| EP-0304309-A1 | Thick film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1989-02-22 | — | — | EP | claimed |
| EP-0262975-A2 | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | claimed |
| US-7291789-B2 | Copper paste and wiring board using the same | NGK SPARK PLUG CO., LTD. (JP) | 2007-11-06 | — | — | US | disclosed |
| US-20050051356-A1 | Copper paste and wiring board using the same | NGK SPARK PLUG CO., LTD. | 2005-03-10 | — | — | US | disclosed |
| EP-1385204-A2 | Copper paste and wiring board using the same | NGK SPARK PLUG CO., LTD (JP) | 2004-01-28 | — | — | EP | disclosed |
| EP-0431938-A1 | Dielectric compositions of devitrified glass | GENERAL ELECTRIC COMPANY (US) | 1991-06-12 | — | — | EP | disclosed |
| EP-0431938-A1 | Dielectric compositions of devitrified glass | GENERAL ELECTRIC COMPANY (US) | 1991-06-12 | — | — | EP | disclosed |
| US-4997795-A | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | GENERAL ELECTRIC COMPANY (US) | 1991-03-05 | — | — | US | disclosed |
| US-4997795-A | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | GENERAL ELECTRIC COMPANY (US) | 1991-03-05 | — | — | US | disclosed |
| EP-0304309-A1 | Thick film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1989-02-22 | — | — | EP | disclosed |
| EP-0262975-A3 | THICK-FILM COPPER CONDUCTOR INKS | GENERAL ELECTRIC COMPANY (US) | 1989-02-08 | — | — | EP | disclosed |
| US-4788163-A | SUBSTRATES FOR DIRECT MOUNTING OF SILICON CHIPS; DIELECTRICS; THICK FILM VIA-FILL INKS | GENERAL ELECTRIC COMPANY (US) | 1988-11-29 | — | — | US | disclosed |
| EP-0262975-A2 | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | disclosed |
| EP-0262975-A2 | Thick-film copper conductor inks | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | disclosed |
| EP-0262974-A2 | Dielectric inks and frits for multilayer circuits | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | disclosed |
| EP-0262974-A2 | Dielectric inks and frits for multilayer circuits | GENERAL ELECTRIC COMPANY (US) | 1988-04-06 | — | — | EP | disclosed |