⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5412779 | 0.94 | — | — | |
| SCHEMBL28271535 | 0.93 | — | — | |
| SCHEMBL134828 | 0.93 | — | — | |
| SCHEMBL790595 | 0.93 | — | — | |
| SCHEMBL645392 | 0.86 | — | — | |
| SCHEMBL9784973 | 0.86 | — | — | |
| SCHEMBL9762470 | 0.86 | — | — | |
| SCHEMBL11790595 | 0.86 | — | — | |
| SCHEMBL6721208 | 0.86 | — | — | |
| SCHEMBL11298856 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0454734-A4 | DEVITRIFYING GLASS FORMULATIONS FOR LOW EXPANSION PRINTED-CIRCUIT SUBSTRATES AND INKS | — | 1992-03-11 | — | — | EP | disclosed |
| EP-0454734-A1 | DEVITRIFYING GLASS FORMULATIONS FOR LOW EXPANSION PRINTED-CIRCUIT SUBSTRATES AND INKS | DAVID SARNOFF RESEARCH CENTER (US) | 1991-11-06 | — | — | EP | disclosed |
| WO-1990008110-A1 | DEVITRIFYING GLASS FORMULATIONS FOR LOW EXPANSION PRINTED-CIRCUIT SUBSTRATES AND INKS | DAVID SARNOFF RESEARCH CENTER, INC. (US) | 1990-07-26 | — | — | WO | disclosed |
| US-4863517-A | Via fill ink composition for integrated circuits | GENERAL ELECTRIC COMPANY (US) | 1989-09-05 | — | — | US | disclosed |
| EP-0304310-A1 | Devitrifying glass frits | GENERAL ELECTRIC COMPANY (US) | 1989-02-22 | — | — | EP | disclosed |
| EP-0304310-A1 | Devitrifying glass frits | GENERAL ELECTRIC COMPANY (US) | 1989-02-22 | — | — | EP | disclosed |
| US-4788163-A | SUBSTRATES FOR DIRECT MOUNTING OF SILICON CHIPS; DIELECTRICS; THICK FILM VIA-FILL INKS | GENERAL ELECTRIC COMPANY (US) | 1988-11-29 | — | — | US | disclosed |