SCHEMBL541812

SCHEMBL541812

C(OCC1CO1)C1CO1.OC1(O)CCCCC1

nearest known ligand 0.45

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.45
MAPK1 P28482 1/20 0.45
ALDH1A1 P00352 5/20 0.41
SMN1; SMN2 Q16637 1/20 0.39
TDP1 Q9NUW8 2/20 0.37
TP53 P04637 1/20 0.36
CYP3A4 P08684 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23152368 1.00 TSHR (0.45) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
SCHEMBL6384092 0.98 TSHR (0.47) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
Cyclohexane SCHEMBL960269 0.82 TSHR (0.62) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
SCHEMBL8044179 0.82 TSHR (0.62) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
Cyclopropane SCHEMBL963062 0.82 TSHR (0.62) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
SCHEMBL961313 0.82 TSHR (0.62) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
SCHEMBL1357524 0.80 TSHR (0.42) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
Cyclohexane SCHEMBL663994 0.80 TSHR (0.54) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
Cyclohexane SCHEMBL17941724 0.80 TSHR (0.54) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1
Methyl Alcohol SCHEMBL3660410 0.80 TSHR (0.54) TSHRMAPK1ALDH1A1SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 790 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12435237-B2 UV resistant surfacing materials for composite parts CYTEC INDUSTRIES INC. (US) 2025-10-07 US claimed
CN-120137480-A High-toughness epoxy floor coating and preparation method thereof 上海正欧实业有限公司 2025-06-13 CN claimed
CN-119979080-A Yellowing-resistant epoxy resin adhesive and preparation method thereof 云胜电子胶粘剂(深圳)有限公司 2025-05-13 CN claimed
CN-119775720-A Foaming putty for filling gaps of sandwich composite material and preparation method thereof 武汉航天智能防护科技有限责任公司 2025-04-08 CN claimed
CN-115873546-B Quick-curing epoxy grouting liquid for low-viscosity water plugging and preparation method thereof 长沙新德航化工有限公司 2025-02-28 CN claimed
CN-119242237-A Structural adhesive, preparation method thereof and wind power blade 中材科技风电叶片股份有限公司 2025-01-03 CN claimed
CN-116285818-B Joint beautifying curing agent capable of being constructed in winter and preparation method thereof 湖北三棵树新材料科技有限公司 2024-10-01 CN claimed
CN-116874867-B Carbon dioxide adduct foaming agent of polyamine polymer with main chain containing ether bond 四川大学 2024-08-20 CN claimed
CN-114901752-B UV resistant surfacing material for composite parts 塞特工业公司 2024-06-07 CN claimed
CN-115463548-B Pollution-resistant reverse osmosis membrane and preparation method thereof 恩泰环保科技(常州)有限公司 2024-04-19 CN claimed
US-20030208008-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method RUBINSZTAJN MALGORZATA IWONA (US) 2003-11-06 US claimed
US-6617401-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-6617400-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-20030071368-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US claimed
US-20030071367-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US claimed
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US claimed
WO-2002019440-A1 ENCAPSULANTS FOR SOLID STATE DEVICES GENERAL ELECTRIC COMPANY (US) 2002-03-07 WO claimed
CN-1210860-A 1,2-cyclohexandiol diglycide ether and its preparation and use HONGJIANG CITY NO 4 CHEMICAL P (CN) 1999-03-17 CN claimed
US-5883160-A UNIFORM, CURABLE BLEND OF BISPHENOL-BASED EPOXY RESIN, (CYCLO)ALKYLENE GLYCOL DIGLYCIDYL ETHER, POLYCARBOXYLIC ANHYDRIDE, RED PHOSPHORUS, AND HYDRATED ALUMINA SOMAR CORPORATION (JP) 1999-03-16 US claimed
CN-1184131-A Flame-retardant epoxy resin composition for case potting of film capacitors SOMAR CORP (JP) 1998-06-10 CN claimed