SCHEMBL5427043

SCHEMBL5427043

CCOCOCC=C[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4173215 0.87
SCHEMBL23303 0.71
SCHEMBL23853342 0.70 PTGS1 (0.34)
SCHEMBL5685546 0.69
SCHEMBL25079496 0.69
SCHEMBL15448059 0.68 ALDH1A1 (0.35)
SCHEMBL7769047 0.68 ALDH1A1 (0.35)
SCHEMBL7769045 0.68 ALDH1A1 (0.35)
SCHEMBL15437113 0.67 ALDH1A1 (0.39)
Hydrogen Sulfide SCHEMBL2524388 0.67 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7172657-B2 Cleaning method of treatment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2007-02-06 US claimed
EP-0854507-B1 Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same SHARP KK (JP) 2006-06-07 EP claimed
EP-0852229-B1 Precursor with (methoxy) (methyl) silylolefin ligands to deposit copper and method for the same SHARP KK (JP) 2003-03-05 EP claimed
US-6090960-A CUPROUS (HEXAFLUOROACETYLACETONATE) COMPLEX WITH A METHOXYSILYLOLEFIN SHARP LABORATORIES OF AMERICA, INC. (US) 2000-07-18 US claimed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP claimed
EP-0852229-A2 Precursor with (methoxy) (methyl) silylolefin ligands to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-08 EP claimed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US claimed
US-20070074739-A1 Cleaning method of treatment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2007-04-05 US disclosed
US-7172657-B2 Cleaning method of treatment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2007-02-06 US disclosed
EP-0854507-B1 Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same SHARP KK (JP) 2006-06-07 EP disclosed
EP-0852229-B1 Precursor with (methoxy) (methyl) silylolefin ligands to deposit copper and method for the same SHARP KK (JP) 2003-03-05 EP disclosed
US-20010020478-A1 Cleaning method of tratment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2001-09-13 US disclosed
US-6090960-A CUPROUS (HEXAFLUOROACETYLACETONATE) COMPLEX WITH A METHOXYSILYLOLEFIN SHARP LABORATORIES OF AMERICA, INC. (US) 2000-07-18 US disclosed
EP-0987346-A1 Copper deposition method using a precursor with (alkyloxy) (alkyl)silylolefin ligands Sharp Kabushiki Kaisha (JP) 2000-03-22 EP disclosed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP disclosed
EP-0852229-A2 Precursor with (methoxy) (methyl) silylolefin ligands to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-08 EP disclosed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US disclosed