Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Carbon Monoxide SCHEMBL934412 | 1.00 | — | — | |
| Formaldehyde SCHEMBL14054347 | 0.87 | TSHR (0.33) | TSHRALDH1A1 | |
| SCHEMBL1231386 | 0.87 | — | — | |
| Phosphine SCHEMBL25383103 | 0.82 | — | — | |
| SCHEMBL16738291 | 0.82 | — | — | |
| Carbon Monoxide SCHEMBL2842408 | 0.67 | TSHR (0.31) | TSHRALDH1A1 | |
| Carbon Monoxide SCHEMBL2844193 | 0.67 | — | — | |
| Allyl Alcohol SCHEMBL7495069 | 0.67 | — | — | |
| Carbon Monoxide SCHEMBL9016270 | 0.67 | — | — | |
| Carbon Monoxide SCHEMBL6131565 | 0.67 | TSHR (0.31) | TSHRALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 181 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218503-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2024-07-04 | — | — | US | claimed |
| US-11959167-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2024-04-16 | — | — | US | claimed |
| US-20220298625-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2022-09-22 | — | — | US | claimed |
| US-11384429-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2022-07-12 | — | — | US | claimed |
| EP-3574125-B1 | ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE BY RUTHENIUM DOPING | APPLIED MATERIALS INC (US) | 2021-11-17 | — | — | EP | claimed |
| US-11043415-B2 | Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping | APPLIED MATERIALS, INC. (US) | 2021-06-22 | — | — | US | claimed |
| WO-2021041593-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. (US) | 2021-03-04 | — | — | WO | claimed |
| US-20210062330-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2021-03-04 | — | — | US | claimed |
| US-20200235006-A1 | ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE BY RUTHENIUM DOPING | APPLIED MATERIALS, INC. | 2020-07-23 | — | — | US | claimed |
| US-10600685-B2 | Methods to fill high aspect ratio features on semiconductor substrates with MOCVD cobalt film | APPLIED MATERIALS, INC. (US) | 2020-03-24 | — | — | US | claimed |
| US-7718527-B2 | Method for forming cobalt tungsten cap layers | TOKYO ELECTRON LIMITED (JP) | 2010-05-18 | — | — | US | claimed |
| US-20100081275-A1 | METHOD FOR FORMING COBALT NITRIDE CAP LAYERS | TOKYO ELECTRON LIMITED (JP) | 2010-04-01 | — | — | US | claimed |
| US-20100081276-A1 | METHOD FOR FORMING COBALT TUNGSTEN CAP LAYERS | TOKYO ELECTRON LIMITED (JP) | 2010-04-01 | — | — | US | claimed |
| WO-2009134840-A2 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | claimed |
| WO-2009134925-A2 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | claimed |
| US-20090269507-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2009-10-29 | — | — | US | claimed |
| US-20090246952-A1 | METHOD OF FORMING A COBALT METAL NITRIDE BARRIER FILM | TOKYO ELECTRON LIMITED (JP) | 2009-10-01 | — | — | US | claimed |
| US-20080268635-A1 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS | APPLIED MATERIALS, INC. | 2008-10-30 | — | — | US | claimed |
| WO-2007121249-A2 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. (US) | 2007-10-25 | — | — | WO | claimed |
| US-20070202254-A1 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. | 2007-08-30 | — | — | US | claimed |