⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3934583 | 0.87 | — | — | |
| SCHEMBL28800210 | 0.87 | — | — | |
| SCHEMBL15415791 | 0.87 | — | — | |
| SCHEMBL6541708 | 0.87 | — | — | |
| SCHEMBL6541660 | 0.75 | — | — | |
| SCHEMBL3240764 | 0.75 | — | — | |
| Phosphine SCHEMBL27681768 | 0.75 | — | — | |
| SCHEMBL3240770 | 0.75 | — | — | |
| SCHEMBL8939109 | 0.75 | — | — | |
| SCHEMBL25373886 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 214 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9018667-B2 | Semiconductor chip assembly with post/base heat spreader and dual adhesives | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2015-04-28 | — | — | US | disclosed |
| US-8952526-B2 | Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2015-02-10 | — | — | US | disclosed |
| US-8927339-B2 | Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2015-01-06 | — | — | US | disclosed |
| US-8841171-B2 | Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2014-09-23 | — | — | US | disclosed |
| US-8535985-B2 | Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-17 | — | — | US | disclosed |
| US-8531024-B2 | Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-10 | — | — | US | disclosed |
| US-8525214-B2 | Semiconductor chip assembly with post/base heat spreader with thermal via | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-03 | — | — | US | disclosed |
| US-8415703-B2 | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-04-09 | — | — | US | disclosed |
| US-8378372-B2 | Semiconductor chip assembly with post/base heat spreader and horizontal signal routing | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-02-19 | — | — | US | disclosed |
| US-8354688-B2 | Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-01-15 | — | — | US | disclosed |
| US-20020076911-A1 | Semiconductor chip assembly with bumped molded substrate | LIN CHARLES W C (SG) | 2002-06-20 | — | — | US | disclosed |
| US-6403460-B1 | Method of making a semiconductor chip assembly | LIN CHARLES W C (SG) | 2002-06-11 | — | — | US | disclosed |
| US-6402970-B1 | Method of making a support circuit for a semiconductor chip assembly | LIN CHARLES W C (SG) | 2002-06-11 | — | — | US | disclosed |
| US-6350633-B1 | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint | LIN CHARLES W C (SG) | 2002-02-26 | — | — | US | disclosed |
| US-6350386-B1 | Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly | LIN CHARLES W C (SG) | 2002-02-26 | — | — | US | disclosed |
| US-6350632-B1 | Semiconductor chip assembly with ball bond connection joint | LIN CHARLES W C (SG) | 2002-02-26 | — | — | US | disclosed |
| US-20010009168-A1 | Copper Alloy | WATERBURY ROLLING MILLS, INC. | 2001-07-26 | — | — | US | disclosed |
| US-6241831-B1 | COPPER-MAGNESIUM-PHOSHPOROUS ALLOYS POSSESSING HIGH TENSILE STRENGTH AND ELECTROCONDUCTIVITY, IMPROVED DUCTILITY, FORMABILITY, AND RESISTANCE TO SOFTENING | WATERBURY ROLLING MILLS, INC. | 2001-06-05 | — | — | US | disclosed |
| EP-1063309-A2 | Copper alloy | Waterbury Rolling Mills, Inc. (US) | 2000-12-27 | — | — | EP | disclosed |
| WO-2000075392-A1 | COPPER ALLOY | WATERBURY ROLLING MILLS, INC. (US) | 2000-12-14 | — | — | WO | disclosed |