⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL54587 | 0.87 | — | — | |
| SCHEMBL6541660 | 0.87 | — | — | |
| SCHEMBL4085678 | 0.82 | — | — | |
| SCHEMBL258579 | 0.82 | — | — | |
| SCHEMBL2637885 | 0.82 | — | — | |
| SCHEMBL542125 | 0.82 | — | — | |
| SCHEMBL1889567 | 0.82 | — | — | |
| SCHEMBL19640274 | 0.67 | — | — | |
| SCHEMBL9274019 | 0.67 | — | — | |
| SCHEMBL19305766 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119162480-A | Preparation method of copper-magnesium-phosphorus alloy | 安徽飞翔新材料科技有限公司 | 2024-12-20 | — | — | CN | claimed |
| CN-1344425-A | Lead frame moisture barrier for molded plastic electronic packages | RJR POLYMERS INC (US) | 2002-04-10 | — | — | CN | claimed |
| EP-1171911-A1 | LEAD FRAME MOISTURE BARRIER FOR MOLDED PLASTIC ELECTRONIC PACKAGES | RJR Polymers, Inc. (US) | 2002-01-16 | — | — | EP | claimed |
| US-6214152-B1 | APPLYING HEAT CURABLE ADHESIVE; MOLDING; CURING | RJR POLYMERS, INC. | 2001-04-10 | — | — | US | claimed |
| WO-2000057466-A1 | LEAD FRAME MOISTURE BARRIER FOR MOLDED PLASTIC ELECTRONIC PACKAGES | RJR POLYMERS, INC. (US) | 2000-09-28 | — | — | WO | claimed |
| CN-119162480-A | Preparation method of copper-magnesium-phosphorus alloy | 安徽飞翔新材料科技有限公司 | 2024-12-20 | — | — | CN | disclosed |
| CN-119162480-A | Preparation method of copper-magnesium-phosphorus alloy | 安徽飞翔新材料科技有限公司 | 2024-12-20 | — | — | CN | disclosed |
| CN-119162480-A | Preparation method of copper-magnesium-phosphorus alloy | 安徽飞翔新材料科技有限公司 | 2024-12-20 | — | — | CN | disclosed |
| EP-3348659-B1 | COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTICALLY-WORKED MATERIAL FOR ELECTRONIC/ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, AND BUSBAR | MITSUBISHI MATERIALS CORP (JP) | 2020-12-23 | — | — | EP | disclosed |
| CN-1182271-C | Copper alloy | �����ز�� | 2004-12-29 | — | — | CN | disclosed |
| CN-1182271-C | Copper alloy | �����ز�� | 2004-12-29 | — | — | CN | disclosed |
| US-6689232-B2 | Copper alloy | GBC METALS, LLC (FORMERLY GLOBAL METALS, LLC) | 2004-02-10 | — | — | US | disclosed |
| US-4611748-A | Process and apparatus for fabricating optical fiber cables | OLIN CORPORATION (US) | 1986-09-16 | — | — | US | disclosed |
| US-4579420-A | Two-pole powered ruggedized optical fiber cable and method and apparatus for forming the same | OLIN CORPORATION (US) | 1986-04-01 | — | — | US | disclosed |
| US-4577925-A | Optical fiber communication cables and method and apparatus for assembling same | OLIN CORPORATION (US) | 1986-03-25 | — | — | US | disclosed |
| US-4555054-A | Process and apparatus for fabricating optical fiber cables | OLIN CORPORATION (US) | 1985-11-26 | — | — | US | disclosed |
| EP-0127437-A2 | Process and apparatus for fabricating optical fiber cables | Olin Corporation (US) | 1984-12-05 | — | — | EP | disclosed |
| US-4477147-A | Method and apparatus for assembling an optical fiber communication cable | OLIN CORPORATION (US) | 1984-10-16 | — | — | US | disclosed |
| EP-0115441-A2 | Process and apparatus for fabricating tubular structures | Olin Corporation (US) | 1984-08-08 | — | — | EP | disclosed |
| EP-0103411-A2 | Optical fiber communication cables and method and apparatus for assembling same | Olin Corporation (US) | 1984-03-21 | — | — | EP | disclosed |