Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CASP1 | P29466 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | PKM | P14618 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | PDPK1 | O15530 | 1/20 | 0.36 |
| ▸ | PI4KA | P42356 | 1/20 | 0.36 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.36 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.36 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.36 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.36 |
| ▸ | DHFR | P00374 | 1/20 | 0.35 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.35 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.35 |
| ▸ | TLR7 | Q9NYK1 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16460924 | 1.00 | CASP1 (0.38) | CASP1ALDH1A1PKMHPGDPDPK1 | |
| SCHEMBL5983208 | 0.83 | CASP1 (0.39) | CASP1DHFR | |
| SCHEMBL10697416 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL28413083 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL28300118 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL9817100 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL9133514 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL730079 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL4445935 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 | |
| SCHEMBL27700043 | 0.83 | KCNH2 (0.50) | ALDH1A1PKMHPGDKCNH2GPR84 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 181 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3331959-A1 | ANIONIC CURABLE COMPOSITIONS | Designer Molecules, Inc. (US) | 2018-06-13 | — | — | EP | claimed |
| WO-2017027482-A1 | ANIONIC CURABLE COMPOSITIONS | DESIGNER MOLECULES, INC. (US) | 2017-02-16 | — | — | WO | claimed |
| US-7067930-B2 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | claimed |
| US-20060051587-A1 | Thermosetting resin composition and adhesive film | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-03-09 | — | — | US | claimed |
| US-6558812-B2 | Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-06 | — | — | US | claimed |
| US-6534193-B2 | Containing a low molecular weight indene-styrene or indene-chroman-styrene copolymer; semiconductor device sealed with the cured product of the liquid epoxy resin | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-18 | — | — | US | claimed |
| US-20020089071-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-11 | — | — | US | claimed |
| US-20020077421-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-06-20 | — | — | US | claimed |
| US-20020045709-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-18 | — | — | US | claimed |
| US-20250279392-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| WO-2025023309-A1 | COMPOSITION FOR FORMING CURED FILM, ALIGNMENT MATERIAL, AND PHASE-DIFFERENCE MATERIAL | 日産化学株式会社 | 2025-01-30 | — | — | WO | disclosed |
| CN-119053888-A | Resin composition for thermosetting photo-alignment film | 日产化学株式会社 | 2024-11-29 | — | — | CN | disclosed |
| CN-118715462-A | Resin composition for thermosetting photo-alignment film | 日产化学株式会社 | 2024-09-27 | — | — | CN | disclosed |
| US-20240240059-A1 | EPOXY RESIN MODIFIER, EPOXY RESIN COMPOSITION CONTAINING SAME, ADHESIVE COMPOSED OF EPOXY RESIN COMPOSITION, AND RESIN CURED PRODUCT OBTAINED BY CURING EPOXY RESIN COMPOSITION | OTSUKA CHEMICAL CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| US-20030069333-A1 | Adhesive composition | FUJITSU LIMITED (JP) | 2003-04-10 | — | — | US | disclosed |
| US-20020077421-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-06-20 | — | — | US | disclosed |
| EP-0949286-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0448862-B1 | Particulate spacers and a method for producing the same, and a method for producing a liquid crystal display cell by using the particulate spacers | SEKISUI FINE CHEMICAL CO LTD (JP) | 1996-12-11 | — | — | EP | disclosed |
| US-5130831-A | Particulate spacers and liquid crystal display cells containing these spacers | SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1992-07-14 | — | — | US | disclosed |
| EP-0448862-A2 | Particulate spacers and a method for producing the same, and a method for producing a liquid crystal display cell by using the particulate spacers | SEKISUI FINE CHEMICAL CO., LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |