SCHEMBL547250

SCHEMBL547250

Oc1nc(-c2ccccc2)[nH]c1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.48
NPC1 O15118 1/20 0.48
RAB9A P51151 1/20 0.48
RNASEH1 O60930 1/20 0.47
ERCC1 P07992 1/20 0.47
FEN1 P39748 1/20 0.47
ERCC4 Q92889 1/20 0.47
PIN1 Q13526 2/20 0.47
CYP1A2 P05177 1/20 0.47
MAPK1 P28482 1/20 0.47
CASP1 P29466 1/20 0.47
CYP2C19 P33261 1/20 0.47
TNKS O95271 3/20 0.45
PARP1 P09874 3/20 0.45
TNKS2 Q9H2K2 3/20 0.45
MAPT P10636 3/20 0.43
ALDH1A1 P00352 2/20 0.43
POLB P06746 1/20 0.43
RXFP1 Q9HBX9 1/20 0.43
MEN1 O00255 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28949646 0.89 ESR1 (0.42) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL27517991 0.79 PIN1 (0.61) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL547135 0.79 PIN1 (0.56) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL13528583 0.77 MAPK13 (0.57) GAACYP1A2CYP2C19MAPTALDH1A1
SCHEMBL17991840 0.76 NPC1 (0.43) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL7878810 0.74 CDC7 (0.45) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL11479983 0.74 PIN1 (0.56) RNASEH1ERCC1FEN1ERCC4PIN1
SCHEMBL30610462 0.72 NPC1 (0.46) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL30610461 0.72 NPC1 (0.46) GAANPC1RAB9ARNASEH1ERCC1
SCHEMBL5774884 0.71 CDC7 (0.47) RAB9ARNASEH1ERCC1FEN1ERCC4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 171 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111944270-B Epoxy resin composition, method for producing the same and use thereof 衡所华威电子有限公司 2024-02-02 CN claimed
CN-111944270-A Epoxy resin composition, process for producing the same and use thereof 衡所华威电子有限公司 2020-11-17 CN claimed
CN-111868149-A Fast curing resin formulation with consistent processing characteristics 塞特工业公司 2020-10-30 CN claimed
CN-102170787-A Compounds, compositions and methods for the treatment of beta-amyloid diseases and synucleinopathies PROTEOTECH INC 2011-08-31 CN claimed
US-20100155964-A1 Adhesive Tape, Semiconductor Package and Electronics SUMITOMO BAKELITE CO., LTD. (JP) 2010-06-24 US claimed
CN-101426875-A Adhesive tape, semiconductor package, and electronic device SUMITOMO BAKELITE CO (JP) 2009-05-06 CN claimed
EP-2011844-A1 ADHESIVE TAPE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-01-07 EP claimed
EP-4711402-A1 TABLET-SHAPED EPOXY RESIN MOLDING MATERIAL, COLUMNAR TABLET, AND METHOD FOR PRODUCING COLUMNAR TABLET Sumitomo Bakelite Co.Ltd. (JP) 2026-03-18 EP disclosed
EP-4685187-A1 EPOXY RESIN COMPOSITION PARTICLE, TABLET, AND METHOD FOR PRODUCING COLUMNAR TABLET Sumitomo Bakelite Co.Ltd. (JP) 2026-01-28 EP disclosed
CN-120089871-A Packaging material for battery and battery 大日本印刷株式会社 2025-06-03 CN disclosed
US-20240400855-A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2024-12-05 US disclosed
WO-2024225223-A1 EPOXY RESIN COMPOSITION PARTICLE, TABLET, AND METHOD FOR PRODUCING COLUMNAR TABLET 住友ベークライト株式会社 2024-10-31 WO disclosed
CN-118176060-A Acid gas adsorbing material and acid gas adsorbing device 日东电工株式会社 2024-06-11 CN disclosed
CN-1463283-A Thermosetting resin compsn. NIPPON PETROCHEMICALS CO LTD (JP) 2003-12-24 CN disclosed
US-20030176598-A1 Thermosetting resin composition NIPPON PETROCHEMICALS CO., LTD. (JP) 2003-09-18 US disclosed
US-6197122-B1 THERMALLY DECOMPOSING ENCAPSULATION AND UNDERFILL TO PROVIDE RESIDUE ON ELECTRONIC COMPONENTS AND DISSOLVING RESIDUE IN POLAR OR BASIC SOLVENT TO EXPOSE ELECTRONIC COMPONENTS CORNELL RESEARCH FOUNDATION, INC. 2001-03-06 US disclosed
US-5973033-A CURED THERMOSETS FOR ENCAPSULATION AND UNDERFILL FOR ELECTRONIC COMPONENTS THAT ARE THERMALLY DECOMPOSABLE TO ALLOW REPAIR, REPLACEMENT, RECOVERY OR RECYCLING OF OPERATIVE ELECTRONIC COMPONENTS CORNELL RESEARCH FOUNDATION, INC. (US) 1999-10-26 US disclosed
US-5948922-A CROSSLINKING THERMOSETTING RESINS CORNELL RESEARCH FOUNDATION, INC. (US) 1999-09-07 US disclosed
EP-0319733-A2 Process, modified rubbers and rubber compositions THE FIRESTONE TIRE & RUBBER COMPANY (US) 1989-06-14 EP disclosed
EP-0286851-A1 Rubber compositions modified with benzimidazolinones THE FIRESTONE TIRE & RUBBER COMPANY (US) 1988-10-19 EP disclosed