⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Selenium SCHEMBL30185404 | 0.87 | — | — | |
| Selenium SCHEMBL338070 | 0.82 | — | — | |
| Selenium SCHEMBL321739 | 0.82 | — | — | |
| SCHEMBL135821 | 0.82 | — | — | |
| Selenium SCHEMBL400941 | 0.82 | — | — | |
| SCHEMBL29613231 | 0.82 | — | — | |
| Selenium SCHEMBL9854069 | 0.82 | — | — | |
| Selenium SCHEMBL3277799 | 0.78 | — | — | |
| Selenium SCHEMBL9424162 | 0.67 | — | — | |
| Selenium SCHEMBL2452564 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1246238-B1 | Method of fabricating a bonded substrate | HEWLETT PACKARD CO (US) | 2007-06-20 | — | — | EP | disclosed |
| CN-1286145-C | Substrate linkage using selenylation reaction | HEWLETT PACKARD CO (US) | 2006-11-22 | — | — | CN | disclosed |
| CN-1286145-C | Substrate linkage using selenylation reaction | HEWLETT PACKARD CO (US) | 2006-11-22 | — | — | CN | disclosed |
| EP-1246238-A3 | Method of fabricating a bonded substrate | Hewlett-Packard Company (US) | 2003-11-26 | — | — | EP | disclosed |
| US-6537846-B2 | Substrate bonding using a selenidation reaction | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2003-03-25 | — | — | US | disclosed |
| US-6537846-B2 | Substrate bonding using a selenidation reaction | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2003-03-25 | — | — | US | disclosed |
| US-20030017679-A1 | Substrate bonding using a selenidation reaction | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2003-01-23 | — | — | US | disclosed |
| US-20030017679-A1 | Substrate bonding using a selenidation reaction | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 2003-01-23 | — | — | US | disclosed |
| CN-1379436-A | Substrate linkage using selenylation reaction | HEWLETT PACKARD CO (US) | 2002-11-13 | — | — | CN | disclosed |
| CN-1379436-A | Substrate linkage using selenylation reaction | HEWLETT PACKARD CO (US) | 2002-11-13 | — | — | CN | disclosed |
| EP-1246238-A2 | Method of fabricating a bonded substrate | Hewlett-Packard Company (US) | 2002-10-02 | — | — | EP | disclosed |
| EP-1246238-A2 | Method of fabricating a bonded substrate | Hewlett-Packard Company (US) | 2002-10-02 | — | — | EP | disclosed |