⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Selenium SCHEMBL338203 | 0.78 | — | — | |
| SCHEMBL31072207 | 0.78 | — | — | |
| Selenium SCHEMBL30141579 | 0.78 | — | — | |
| Selenium SCHEMBL5481695 | 0.78 | — | — | |
| Selenium SCHEMBL9424162 | 0.78 | — | — | |
| Selenium SCHEMBL30502902 | 0.78 | — | — | |
| Selenium SCHEMBL29692300 | 0.78 | — | — | |
| SCHEMBL34461900 | 0.78 | — | — | |
| SCHEMBL560998 | 0.78 | — | — | |
| SCHEMBL2118559 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101479850-B | Bit-erasing architecture for seek-scan probe (ssp) memory storage | INTEL CORP | 2011-08-17 | — | — | CN | disclosed |
| WO-2010062582-A2 | VAPOR DEPOSITION METHOD FOR TERNARY COMPOUNDS | APPLIED MATERIALS, INC. (US) | 2010-06-03 | — | — | WO | disclosed |
| US-20100102417-A1 | VAPOR DEPOSITION METHOD FOR TERNARY COMPOUNDS | APPLIED MATERIALS, INC. (US) | 2010-04-29 | — | — | US | disclosed |
| US-7696507-B2 | Storage nodes, phase change memory devices, and methods of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-04-13 | — | — | US | disclosed |
| CN-101479850-A | Bit-erasing architecture for seek-scan probe (ssp) memory storage | INTEL CORP (US) | 2009-07-08 | — | — | CN | disclosed |
| US-20080093591-A1 | Storage nodes, phase change memory devices, and methods of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD | 2008-04-24 | — | — | US | disclosed |