SCHEMBL5494856

SCHEMBL5494856

COC(=O)C1C2C=CC(C(C(=O)O)C2C(=O)O)C1C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
POLB P06746 5/20 0.48
PPM1B O75688 1/20 0.47
PTPN1 P18031 1/20 0.47
PPP1CC P36873 1/20 0.47
TDP1 Q9NUW8 3/20 0.46
CTDSP1 Q9GZU7 1/20 0.41
HTT P42858 2/20 0.37
ALDH1A1 P00352 1/20 0.37
GLA P06280 1/20 0.37
HPGD P15428 1/20 0.37
CYP2C19 P33261 1/20 0.36
APEX1 P27695 1/20 0.34
SLC6A4 P31645 1/20 0.34
SLC6A3 Q01959 1/20 0.34
PKM P14618 1/20 0.34
SMN1; SMN2 Q16637 2/20 0.33
TP53 P04637 2/20 0.33
NPSR1 Q6W5P4 2/20 0.33
LMNA P02545 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15645293 1.00 POLB (0.48) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL15645760 1.00 POLB (0.48) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL15645762 1.00 POLB (0.48) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL11263569 0.91 CYP2C19 (0.41) POLBPPM1BPTPN1PPP1CCHTT
SCHEMBL3200631 0.86 POLB (0.70) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL3215221 0.86 POLB (0.70) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL389507 0.86 POLB (0.70) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL8760765 0.86 POLB (0.70) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL393414 0.86 POLB (0.70) POLBPPM1BPTPN1PPP1CCTDP1
SCHEMBL12636953 0.83 CYP2C19 (0.40) POLBPPM1BPTPN1PPP1CCHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4257623-B1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2026-05-27 EP disclosed
US-20240085789-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-14 US disclosed
US-20240027907-A1 METHOD FOR PRODUCING PATTERNED SUBSTRATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-01-25 US disclosed
US-20230407089-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-21 US disclosed
EP-4257622-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-11 EP disclosed
EP-4257621-A1 METHOD FOR PRODUCING PATTERNED SUBSTRATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-11 EP disclosed
EP-4257623-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-11 EP disclosed
CN-114945621-A Polyimide resin, photosensitive resin composition, resin film, and electronic device 三菱瓦斯化学株式会社 2022-08-26 CN disclosed
US-20220252979-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM THEREOF MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-08-11 US disclosed
WO-2022118619-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE 三菱瓦斯化学株式会社 2022-06-09 WO disclosed
WO-2022118620-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE 三菱瓦斯化学株式会社 2022-06-09 WO disclosed
EP-2777929-B1 METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM MITSUBISHI GAS CHEMICAL CO (JP) 2016-10-19 EP disclosed
EP-2725067-B1 FLAMEPROOFED ALICYCLIC POLYIMIDE RESIN COMPOSITION AND THIN-WALLED MOLDED BODY OF SAME MITSUBISHI GAS CHEMICAL CO (JP) 2016-02-24 EP disclosed
US-9073297-B2 Method for manufacturing transparent, heat-resistant gas-barrier film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-07-07 US disclosed
US-20140322444-A1 METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-10-30 US disclosed
EP-2777929-A1 METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM Mitsubishi Gas Chemical Company, Inc. (JP) 2014-09-17 EP disclosed
EP-2725067-A1 FLAMEPROOFED ALICYCLIC POLYIMIDE RESIN COMPOSITION AND THIN-WALLED MOLDED BODY OF SAME Mitsubishi Gas Chemical Company, Inc. (JP) 2014-04-30 EP disclosed
US-20140114000-A1 FLAMEPROOFED ALICYCLIC POLYIMIDE RESIN COMPOSITION AND THIN-WALLED MOLDED BODY OF SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-04-24 US disclosed
US-8642181-B2 Metal-clad white laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-02-04 US disclosed
US-20070292709-A1 Metal-Clad White Laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-12-20 US disclosed