SCHEMBL5495547

SCHEMBL5495547

COC(=O)CC(C(=O)O)C(CC(=O)O)C(=O)O

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.64
TSHR P16473 4/20 0.41
SMN1; SMN2 Q16637 1/20 0.37
HSD17B10 Q99714 1/20 0.37
MGAM O43451 1/20 0.37
GAA P10253 1/20 0.37
SI P14410 1/20 0.37
MGAM2 Q2M2H8 1/20 0.37
SLC1A1 P43005 1/20 0.35
SLC22A6 Q4U2R8 1/20 0.35
HTT P42858 1/20 0.33
MMP1 P03956 1/20 0.32
MMP2 P08253 1/20 0.32
MMP3 P08254 1/20 0.32
MMP9 P14780 1/20 0.32
MMP13 P45452 1/20 0.32
FOLH1 Q04609 1/20 0.32
KCNA5 P22460 1/20 0.32
TGFBR1 P36897 1/20 0.31
ALOX15 P16050 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6043806 0.93 TDP1 (0.50) TDP1TSHRHSD17B10MGAMGAA
SCHEMBL11417337 0.92 TDP1 (0.54) TDP1TSHRSMN1; SMN2HSD17B10MGAM
SCHEMBL21427132 0.84 TDP1 (0.42) TDP1TSHRSMN1; SMN2HSD17B10MGAM
SCHEMBL19035870 0.84 TDP1 (0.42) TDP1TSHRSMN1; SMN2HSD17B10MGAM
SCHEMBL17323230 0.82 SLC1A1 (0.43) TDP1TSHRSMN1; SMN2HSD17B10MGAM
SCHEMBL499437 0.81 TDP1 (0.70) TDP1TSHRSMN1; SMN2SLC22A6MMP1
SCHEMBL3500866 0.80 TSHR (0.39) TDP1TSHRSMN1; SMN2HSD17B10MGAM
SCHEMBL22151 0.80 TDP1 (1.00) TDP1TSHRSMN1; SMN2SLC22A6FOLH1
SCHEMBL17517216 0.80 TDP1 (1.00) TDP1TSHRSMN1; SMN2SLC22A6FOLH1
SCHEMBL16925719 0.80 TDP1 (1.00) TDP1TSHRSMN1; SMN2SLC22A6FOLH1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4257623-B1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2026-05-27 EP disclosed
US-12441842-B2 Polyimide resin, photosensitive resin composition, resin film, and electronic device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-14 US disclosed
CN-114945621-B Polyimide resin, photosensitive resin composition, resin film, and electronic device 三菱瓦斯化学株式会社 2024-07-02 CN disclosed
CN-113892058-B Photosensitive resin composition and cured film thereof 三菱瓦斯化学株式会社 2024-05-14 CN disclosed
US-20240085789-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-14 US disclosed
US-20240027907-A1 METHOD FOR PRODUCING PATTERNED SUBSTRATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-01-25 US disclosed
US-20230407089-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-21 US disclosed
EP-4257622-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-11 EP disclosed
EP-4257623-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-11 EP disclosed
EP-4257621-A1 METHOD FOR PRODUCING PATTERNED SUBSTRATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-11 EP disclosed
EP-3978549-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM THEREOF MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-04-06 EP disclosed
WO-2022004290-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PLATING MOLD-ATTACHED SUBSTRATE, AND METHOD FOR MANUFACTURING PLATED OBJECT 東京応化工業株式会社 2022-01-06 WO disclosed
WO-2021140845-A1 POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE 三菱瓦斯化学株式会社 2021-07-15 WO disclosed
WO-2020246349-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM THEREOF 三菱瓦斯化学株式会社 2020-12-10 WO disclosed
EP-2777929-B1 METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM MITSUBISHI GAS CHEMICAL CO (JP) 2016-10-19 EP disclosed
US-9073297-B2 Method for manufacturing transparent, heat-resistant gas-barrier film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-07-07 US disclosed
US-20140322444-A1 METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-10-30 US disclosed
EP-2777929-A1 METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM Mitsubishi Gas Chemical Company, Inc. (JP) 2014-09-17 EP disclosed
US-8642181-B2 Metal-clad white laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-02-04 US disclosed
US-20070292709-A1 Metal-Clad White Laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-12-20 US disclosed