Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.70 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.38 |
| ▸ | FOLH1 | Q04609 | 2/20 | 0.34 |
| ▸ | GABRR1 | P24046 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | MMP1 | P03956 | 1/20 | 0.30 |
| ▸ | MMP2 | P08253 | 1/20 | 0.30 |
| ▸ | MMP3 | P08254 | 1/20 | 0.30 |
| ▸ | MMP9 | P14780 | 1/20 | 0.30 |
| ▸ | MMP13 | P45452 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8979643 | 0.87 | TDP1 (0.58) | TDP1SMN1; SMN2SLC22A6FOLH1LMNA | |
| SCHEMBL165643 | 0.84 | TDP1 (1.00) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| SCHEMBL22151 | 0.84 | TDP1 (1.00) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| SCHEMBL17517216 | 0.84 | TDP1 (1.00) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| SCHEMBL16925719 | 0.84 | TDP1 (1.00) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| SCHEMBL5495547 | 0.81 | TDP1 (0.64) | TDP1SMN1; SMN2SLC22A6FOLH1TSHR | |
| SCHEMBL9355977 | 0.81 | TDP1 (0.93) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| Hydrochloric Acid SCHEMBL8841253 | 0.81 | TDP1 (0.93) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| SCHEMBL269896 | 0.81 | TDP1 (0.93) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 | |
| SCHEMBL9678882 | 0.81 | TDP1 (0.93) | TDP1SMN1; SMN2SLC22A6FOLH1GABRR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 126 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0829503-B1 | Degradable polymer and preparation process of the same | MITSUI CHEMICALS INC (JP) | 2002-04-03 | — | — | EP | claimed |
| EP-0829503-A2 | Degradable polymer and preparation process of the same | MITSUI TOATSU CHEMICALS, INC. (JP) | 1998-03-18 | — | — | EP | claimed |
| WO-2024120097-A1 | POLYIMIDE ELECTROPHORETIC COATING, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF | 合肥汉之和新材料科技有限公司 | 2024-06-13 | — | — | WO | disclosed |
| CN-118019822-A | Adhesive resin composition | 东洋纺MC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-118019817-A | Sheet-like curable adhesive and optical member | 琳得科株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117980430-A | Adhesive resin composition | 东洋纺MC株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117980431-A | Adhesive resin composition | 东洋纺MC株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117784522-A | Curable composition and method for producing same | 株式会社钟化 | 2024-03-29 | — | — | CN | disclosed |
| CN-117751161-A | Polyester resin composition, aqueous dispersion, coating composition, and coating film | 东洋纺MC株式会社 | 2024-03-22 | — | — | CN | disclosed |
| WO-2024053579-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2024-03-14 | — | — | WO | disclosed |
| CN-117590696-A | Photosensitive resin composition | 东京应化工业株式会社 | 2024-02-23 | — | — | CN | disclosed |
| EP-0829503-B1 | Degradable polymer and preparation process of the same | MITSUI CHEMICALS INC (JP) | 2002-04-03 | — | — | EP | disclosed |
| US-5965328-A | IRRADIATING COATING FILM WITH RADIATION THROUGH A MASK, DEVELOPING SAID COATING FILM WITH AN ALKALI DEVELOPER SOLUTION, ELECTROPLATING, PEELING | JSR CORPORATION (JP) | 1999-10-12 | — | — | US | disclosed |
| US-5942369-A | ALKALI-SOLUBLE NOVOLAK RESIN; ALKALI SOLUBLE ACRYLIC RESIN OF RADICAL-POLYMERIZABLE UNITS CONTAINING A: HYDROXYL GROUP, CARBOXYL GROUP, OR PHENOLIC HYDROXYL GROUP; QUINONEDIAZIDE AND SOLVENT; THICK FILMS AS BUMP FORMING MATERIALS | JSR CORPORATION (JP) | 1999-08-24 | — | — | US | disclosed |
| US-5914381-A | Degradable polymer and preparation process of the same | MITSUI CHEMICALS, INC. (JP) | 1999-06-22 | — | — | US | disclosed |
| EP-0855620-A1 | Positive photoresist composition | JSR Corporation (JP) | 1998-07-29 | — | — | EP | disclosed |
| EP-0829503-A2 | Degradable polymer and preparation process of the same | MITSUI TOATSU CHEMICALS, INC. (JP) | 1998-03-18 | — | — | EP | disclosed |
| EP-0605554-A1 | OXIDISING COMPOSITIONS | WARWICK INTERNATIONAL GROUP LIMITED(2660720) (GB) | 1994-07-13 | — | — | EP | disclosed |
| WO-1993006203-A1 | OXIDISING COMPOSITIONS | WARWICK INTERNATIONAL GROUP LTD. (GB) | 1993-04-01 | — | — | WO | disclosed |
| EP-0534772-A2 | Oxidising compositions | WARWICK INTERNATIONAL GROUP LIMITED(Company No. 2754514) (GB) | 1993-03-31 | — | — | EP | disclosed |