Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC3 | O15379 | 1/20 | 0.33 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.33 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.33 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.33 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.33 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.33 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.33 |
| ▸ | HDAC5 | Q9UQL6 | 1/20 | 0.33 |
| ▸ | CTSK | P43235 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15665965 | 0.87 | HDAC4 (0.34) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL1776246 | 0.80 | HDAC4 (0.35) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL147808 | 0.78 | HDAC4 (0.40) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL28811493 | 0.77 | HDAC4 (0.37) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL22578886 | 0.76 | HDAC4 (0.39) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL222930 | 0.75 | HDAC4 (0.38) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL8408268 | 0.75 | HDAC4 (0.35) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL28040133 | 0.74 | HDAC4 (0.34) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL21753673 | 0.73 | HDAC3 (0.33) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL1684026 | 0.72 | HDAC4 (0.40) | HDAC3HDAC4HDAC1HDAC7HDAC2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1373331-A4 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS (US) | 2007-01-17 | — | — | EP | claimed |
| US-6924339-B2 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-08-02 | — | — | US | claimed |
| EP-1373331-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-01-02 | — | — | EP | claimed |
| US-20030204035-A1 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS INC. | 2003-10-30 | — | — | US | claimed |
| US-6610808-B2 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS, INC. | 2003-08-26 | — | — | US | claimed |
| US-20020173594-A1 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-11-21 | — | — | US | claimed |
| WO-2002073307-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-09-19 | — | — | WO | claimed |
| WO-2013013568-A1 | PHOTO CURABLE ADHESIVE COMPOSITIONS AND USE THEREOF | HENKEL (CHINA) COMPANY LIMITED (CN) | 2013-01-31 | — | — | WO | disclosed |