SCHEMBL550550

SCHEMBL550550

CCNCCCC[SiH](OC)OC

nearest known ligand 0.50

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 2/20 0.50
CYP1A2 P05177 1/20 0.50
MEN1 O00255 1/20 0.46
GLA P06280 1/20 0.46
KMT2A Q03164 1/20 0.46
TSHR P16473 2/20 0.44
KDM1A O60341 5/20 0.41
SAT1 P21673 3/20 0.35
ALDH1A1 P00352 1/20 0.35
HRH4 Q9H3N8 2/20 0.31
HRH3 Q9Y5N1 2/20 0.31
TP53 P04637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15360653 0.98 CYP2C19 (0.48) CYP2C19CYP1A2MEN1GLAKMT2A
Ammonia Solution, Strong SCHEMBL10482132 0.98 CYP2C19 (0.48) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL5199356 0.93 CYP2C19 (0.48) CYP2C19CYP1A2MEN1GLAKMT2A
Ammonia Solution, Strong SCHEMBL28256574 0.91 CYP2C19 (0.46) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL28975742 0.88 TSHR (0.39) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL272669 0.84 TSHR (0.50) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL614388 0.84 TSHR (0.44) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL16782934 0.83 CYP2C19 (0.39) CYP2C19CYP1A2MEN1GLAKMT2A
SCHEMBL15360400 0.83 TSHR (0.48) CYP2C19CYP1A2KMT2ATSHRALDH1A1
Dimethylamine SCHEMBL18630929 0.81 TSHR (0.41) CYP2C19CYP1A2MEN1GLAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115362203-B Moisture-curable non-yellowing clear compositions and methods of making the same 迈图高新材料公司 2024-07-16 CN claimed
US-20230106223-A1 MOISTURE-CURABLE NON-YELLOWING CLEAR COMPOSITION AND METHOD OF MAKING THEREOFROM MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-06 US claimed
CN-115362203-A Moisture-curable non-yellowing clear composition and preparation method thereof 迈图高新材料公司 2022-11-18 CN claimed
US-11248106-B2 Method of forming an exfoliated or intercalated filler material AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) 2022-02-15 US claimed
WO-2021158370-A1 MOISTURE-CURABLE NON-YELLOWING CLEAR COMPOSITION AND METHOD OF MAKING THEREOFROM MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2021-08-12 WO claimed
US-20210108050-A1 METHOD OF FORMING AN EXFOLIATED OR INTERCALATED FILLER MATERIAL AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) 2021-04-15 US claimed
WO-2019004922-A1 COATING SYSTEM, METHOD OF APPLICATION AND KIT FOR USE Bona AB (SE) 2019-01-03 WO claimed
US-12545691-B2 Tertiary hydroxyl functional alkoxysilanes and methods for preparing thereof HENKEL AG & CO. KGAA (DE) 2026-02-10 US disclosed
EP-4098713-B1 ADHESIVE COMPOSITION AND BONDED STRUCTURE SUNSTAR ENGINEERING INC (JP) 2025-03-12 EP disclosed
WO-2023200156-A1 POLYIMIDE PRECURSOR 피아이첨단소재 주식회사 2023-10-19 WO disclosed
US-20230106223-A1 MOISTURE-CURABLE NON-YELLOWING CLEAR COMPOSITION AND METHOD OF MAKING THEREOFROM MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-06 US disclosed
US-11560445-B2 Silylated polyurethanes and methods for preparing thereof HENKEL AG & CO. KGAA (DE) 2023-01-24 US disclosed
EP-4098713-A1 ADHESIVE COMPOSITION AND BONDED STRUCTURE Sunstar Engineering Inc. (JP) 2022-12-07 EP disclosed
US-20050222300-A1 Encapsulating epoxy resin composition, and electronic parts device using the same HITACHI CHEMICAL CO., LTD. (JP) 2005-10-06 US disclosed
US-20050165202-A1 Curing accelerator for curing resin, curing resin composition and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20050090044-A1 Epoxy resin compositions and semiconductor devices SUMITOMO BAKELITE COMPANY LIMITED (JP) 2005-04-28 US disclosed
CN-1558920-A Epoxy resin composition and semiconductor device ס�ѵ�ľ��ʽ���� 2004-12-29 CN disclosed
WO-2003072655-A1 ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME HITACHI CHEMICAL CO., LTD. (JP) 2003-09-04 WO disclosed
US-5854316-A Epoxy resin composition TORAY INDUSTRIES, INC. (JP) 1998-12-29 US disclosed
EP-0780436-A1 EPOXY RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1997-06-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12545691-B2 Tertiary hydroxyl functional alkoxysilanes and methods for preparing thereof HCCS, EGLN1, RRS1 CYP2C19 749/4885CYP1A2 407/4885MEN1 808/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.