Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NAAA | Q02083 | 4/20 | 0.50 |
| ▸ | TRPA1 | O75762 | 8/20 | 0.47 |
| ▸ | MIF | P14174 | 5/20 | 0.41 |
| ▸ | KEAP1 | Q14145 | 2/20 | 0.40 |
| ▸ | NFE2L2 | Q16236 | 2/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 1/20 | 0.40 |
| ▸ | BACH1 | O14867 | 1/20 | 0.40 |
| ▸ | MAFK | O60675 | 1/20 | 0.40 |
| ▸ | EGFR | P00533 | 1/20 | 0.40 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.40 |
| ▸ | GSK3B | P49841 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL48818 | 0.81 | — | — | |
| SCHEMBL551246 | 0.80 | NAAA (0.48) | NAAATRPA1MIFKEAP1NFE2L2 | |
| SCHEMBL21056132 | 0.79 | NAAA (0.31) | NAAA | |
| SCHEMBL5697649 | 0.79 | NAAA (0.31) | NAAA | |
| SCHEMBL703802 | 0.76 | — | — | |
| SCHEMBL30493953 | 0.74 | — | — | |
| SCHEMBL407181 | 0.74 | — | — | |
| SCHEMBL3235533 | 0.73 | — | — | |
| SCHEMBL6709894 | 0.73 | — | — | |
| SCHEMBL3229737 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1652891-B1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO LTD (JP) | 2012-06-13 | — | — | EP | disclosed |
| US-8110645-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2012-02-07 | — | — | US | disclosed |
| US-20090264602-A1 | Curable Resin Composition and Cold Setting Adhesive | KONISHI CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7576167-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2009-08-18 | — | — | US | disclosed |
| US-20060189736-A1 | Curable resin composition and cold-setting adhesive | KONISHI CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| EP-1652891-A1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |