SCHEMBL5519793

SCHEMBL5519793

CCC(=NO)C(C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL266182 0.89 ALDH1A1 (0.35)
SCHEMBL12092052 0.77
SCHEMBL6753422 0.77
SCHEMBL9445736 0.74
SCHEMBL11221672 0.74
SCHEMBL9570780 0.71 ALDH1A1 (0.42)
SCHEMBL29138738 0.69
SCHEMBL11657277 0.69
SCHEMBL11657275 0.69
SCHEMBL15758830 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1634928-B1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHINETSU CHEMICAL CO (JP) 2007-10-31 EP claimed
CN-108026205-B Process for producing modified solution-polymerized diene rubber for mixing silica and rubber composition 有限会社ETIC 2021-01-29 CN disclosed
CN-107922785-B Coating material and laminate 大金工业株式会社 2020-05-12 CN disclosed
CN-108026205-A The manufacture method and its rubber composition of silica mixing modified solution polymerization polydiene 有限会社ETIC 2018-05-11 CN disclosed
CN-107922785-A coating and laminate 大金工业株式会社 2018-04-17 CN disclosed
CN-102585504-B Moisture-thickening heat-conductive silicone grease composition SHIN-ETSU CHEMICAL INDUSTRY CO., LTD. (JP) 2016-04-27 CN disclosed
CN-103562318-B Room-temperature moisture thickening type thermal conductivity silicone grease composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-01-06 CN disclosed
CN-103562318-A Room temperature and humidity thickening thermo-conductive silicon grease composition SHINETSU CHEMICAL CO 2014-02-05 CN disclosed
CN-101993540-B Organic polymethylene silicon composition and condensate thereof SHIN ETSU EHEMICAL CO LTD 2013-06-05 CN disclosed
CN-101993540-A Organic polymethylene silicon composition and condensate thereof SHINETSU CHEMICAL CO 2011-03-30 CN disclosed
EP-1414893-B1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION DOW CORNING TORAY CO LTD (JP) 2006-12-13 EP disclosed
CN-1220720-C Room-temperature-curable organopolysiloxane composition DOW CORNING TORAY SILICONE (JP) 2005-09-28 CN disclosed
CN-1637099-A Antifouling condensation curing organopolysiloxane composition and underwater structure SHINETSU CHEMICAL CO (JP) 2005-07-13 CN disclosed
US-6875806-B2 Room temperature curable organopolysiloxane composition and part using the same as adhesive SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-05 US disclosed
US-20040176517-A1 Room-temperature-curable organopolysiloxane composition DOW TORAY CO., LTD. (JP) 2004-09-09 US disclosed
CN-1527861-A Room-temperature-curable organopolysiloxane composition ������������ʽ���� 2004-09-08 CN disclosed
EP-1414893-A1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION Dow Corning Toray Silicone Co., Ltd. (JP) 2004-05-06 EP disclosed
US-20030211339-A1 Room temperature curable organopolysiloxane composition and part using the same as adhesive SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-11-13 US disclosed
WO-2003010227-A1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION DOW CORNING TORAY SILICONE CO., LTD. (JP) 2003-02-06 WO disclosed
US-5032660-A Polysiloxanes, titanium-phosphate organic curing agent TIOXIDE GROUP PLC (GB) 1991-07-16 US disclosed