SCHEMBL5533667

SCHEMBL5533667

CCCCC(I)(I)I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12348004 0.90
SCHEMBL16970061 0.87 TSHR (0.50)
SCHEMBL16969783 0.87 TSHR (0.50)
SCHEMBL16969596 0.87 TSHR (0.50)
SCHEMBL16970324 0.87 TSHR (0.50)
SCHEMBL16969553 0.87 TSHR (0.50)
SCHEMBL16970194 0.87 TSHR (0.50)
SCHEMBL12348014 0.87 TSHR (0.50)
SCHEMBL16969681 0.87 TSHR (0.50)
SCHEMBL16970222 0.87 TSHR (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119751718-A Dialkoxy magnesium carrier type solid catalyst component for ethylene polymerization or copolymerization, preparation method and application thereof 任丘市利和科技发展有限公司 2025-04-04 CN claimed
CN-119751718-A Dialkoxy magnesium carrier type solid catalyst component for ethylene polymerization or copolymerization, preparation method and application thereof 任丘市利和科技发展有限公司 2025-04-04 CN disclosed
US-11786600-B2 Cliptac composition OTSUKA PHARMACEUTICAL CO., LTD. (JP) 2023-10-17 US disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
US-8887374-B2 Method of manufacturing fused silica crucible JAPAN SUPER QUARTZ CORPORATION (JP) 2014-11-18 US disclosed
US-8097618-B2 Pyridine derivatives and their use in the treatment of psychotic disorders GLAXOSMITHKLINE LLC (US) 2012-01-17 US disclosed
US-8008506-B2 Indazole compounds ASAHI KASEI PHARMA CORPORATION (JP) 2011-08-30 US disclosed
US-20110190276-A1 Pyridine Derivatives And Their Use In The Treatment Of Psychotic Disorders KaNDy Therapeutics Limited (GB) 2011-08-04 US disclosed
US-7683056-B2 Pyridine derivatives and their use in the treatment of psychotic disorders GLAXOSMITHKLINE LLC (US) 2010-03-23 US disclosed
US-20070015892-A1 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film JSR CORPORATION (JP) 2007-01-18 US disclosed
EP-1705206-A1 METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM JSR Corporation (JP) 2006-09-27 EP disclosed