SCHEMBL5544537

SCHEMBL5544537

CCCC(C(=O)O)=C(Cl)Cl

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.50
HDAC3 O15379 4/20 0.46
HDAC1 Q13547 4/20 0.46
HDAC2 Q92769 4/20 0.46
HDAC8 Q9BY41 4/20 0.46
FFAR3 O14843 3/20 0.46
CES2 O00748 1/20 0.41
CES1 P23141 1/20 0.41
ALDH1A1 P00352 5/20 0.40
FNTA P49354 2/20 0.40
FNTB P49356 2/20 0.40
TP53 P04637 1/20 0.40
THRB P10828 1/20 0.40
PGGT1B P53609 1/20 0.40
AKR1B1 P15121 1/20 0.35
HDAC6 Q9UBN7 1/20 0.35
PPARG P37231 4/20 0.33
PPARD Q03181 4/20 0.33
PPARA Q07869 4/20 0.33
GPR84 Q9NQS5 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6682466 0.84 TSHR (0.50) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL184432 0.83 HDAC3 (0.56) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL554602 0.83 HDAC3 (0.56) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL554603 0.83 HDAC3 (0.56) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL305220 0.80 HDAC3 (0.53) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL305222 0.80 HDAC3 (0.53) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL1563512 0.78 HDAC3 (0.50) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL7184711 0.77 TSHR (0.42) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL2370758 0.76 HDAC3 (0.48) TSHRHDAC3HDAC1HDAC2HDAC8
SCHEMBL8951256 0.76 HDAC3 (0.48) TSHRHDAC3HDAC1HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070251638-A1 Method and composition for the adhesion of materials QUANTUM RESEARCH OF AMERICA INC. (US) 2007-11-01 US claimed
US-20070251638-A1 Method and composition for the adhesion of materials QUANTUM RESEARCH OF AMERICA INC. (US) 2007-11-01 US disclosed
US-4784719-A Dry etching procedure AMERICAN TELEPHONE AND TELEGRAPH COMPANY, AT&T BELL LABORATORIES (US) 1988-11-15 US disclosed
EP-0140240-B1 PROCESS FOR FORMING AN ORGANIC THIN FILM HITACHI, LTD. (JP) 1988-07-06 EP disclosed
EP-0229104-A1 PROCEDURE FOR FABRICATING DEVICES INVOLVING DRY ETCHING AT&T Corp. (US) 1987-07-22 EP disclosed
WO-1987000345-A1 PROCEDURE FOR FABRICATING DEVICES INVOLVING DRY ETCHING AMERICAN TELEPHONE & TELEGRAPH COMPANY (US) 1987-01-15 WO disclosed
US-4604294-A VACUUM VAPOR DEPOSITION HITACHI, LTD. (JP) 1986-08-05 US disclosed
EP-0140240-A1 Process for forming an organic thin film HITACHI, LTD. (JP) 1985-05-08 EP disclosed