⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3086918 | 0.92 | — | — | |
| SCHEMBL548297 | 0.89 | — | — | |
| SCHEMBL8821822 | 0.70 | — | — | |
| SCHEMBL13788205 | 0.69 | — | — | |
| SCHEMBL25297514 | 0.67 | — | — | |
| SCHEMBL12234986 | 0.65 | — | — | |
| SCHEMBL990358 | 0.65 | — | — | |
| SCHEMBL12234987 | 0.65 | — | — | |
| SCHEMBL12377423 | 0.65 | — | — | |
| SCHEMBL15789475 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117417718-A | Epoxy pouring sealant and preparation method and application thereof | 珠海格力新材料有限公司 | 2024-01-19 | — | — | CN | claimed |
| CN-114561100-B | Transparent polyimide solution, preparation method thereof, transparent polyimide film and application thereof | 臻鼎科技股份有限公司 | 2024-07-05 | — | — | CN | disclosed |
| EP-4323470-A1 | ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE | Versum Materials US, LLC (US) | 2024-02-21 | — | — | EP | disclosed |
| CN-117417718-A | Epoxy pouring sealant and preparation method and application thereof | 珠海格力新材料有限公司 | 2024-01-19 | — | — | CN | disclosed |
| WO-2022246356-A1 | ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE | VERSUM MATERIALS US, LLC (US) | 2022-11-24 | — | — | WO | disclosed |
| EP-3999621-A1 | COMPOSITIONS FOR REMOVING ETCH RESIDUES, METHODS OF USING AND USE THEREOF | Versum Materials US, LLC (US) | 2022-05-25 | — | — | EP | disclosed |
| US-7215912-B2 | Intermediate transfer medium and image forming apparatus using the intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20050207800-A1 | Intermediate transfer medium and image forming apparatus using the intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2005-09-22 | — | — | US | disclosed |
| US-20050136245-A1 | Intermediate transfer medium, film forming liquid for the intermediate transfer medium and image forming apparatus using intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2005-06-23 | — | — | US | disclosed |