Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DGKA | P23743 | 1/20 | 0.50 |
| ▸ | LMNA | P02545 | 3/20 | 0.47 |
| ▸ | PAM | P19021 | 2/20 | 0.46 |
| ▸ | MAPT | P10636 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | CES2 | O00748 | 3/20 | 0.43 |
| ▸ | CES1 | P23141 | 3/20 | 0.43 |
| ▸ | TSHR | P16473 | 4/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.42 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.42 |
| ▸ | NAAA | Q02083 | 1/20 | 0.42 |
| ▸ | PPARG | P37231 | 4/20 | 0.42 |
| ▸ | PPARD | Q03181 | 4/20 | 0.42 |
| ▸ | PPARA | Q07869 | 4/20 | 0.42 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.42 |
| ▸ | HDAC11 | Q96DB2 | 3/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.42 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.42 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.42 |
| ▸ | TLR2 | O60603 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL557169 | 1.00 | DGKA (0.50) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL557016 | 1.00 | DGKA (0.50) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL557871 | 1.00 | DGKA (0.50) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL1083409 | 0.98 | DGKA (0.48) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL1083084 | 0.98 | DGKA (0.48) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL556674 | 0.96 | DGKA (0.50) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL11747332 | 0.96 | DGKA (0.50) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL556133 | 0.96 | DGKA (0.50) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL556542 | 0.95 | DGKA (0.48) | DGKALMNAPAMMAPTMAPK1 | |
| SCHEMBL556496 | 0.95 | DGKA (0.48) | DGKALMNAPAMMAPTMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1652891-B1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO LTD (JP) | 2012-06-13 | — | — | EP | disclosed |
| US-8110645-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2012-02-07 | — | — | US | disclosed |
| EP-1788035-B1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | KONISHI CO LTD (JP) | 2011-01-19 | — | — | EP | disclosed |
| US-20090264602-A1 | Curable Resin Composition and Cold Setting Adhesive | KONISHI CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7576167-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2009-08-18 | — | — | US | disclosed |
| US-20080312401-A1 | Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive | SATO SHINICHI | 2008-12-18 | — | — | US | disclosed |
| US-7449519-B2 | Curing resin, method for producing same and curing resin composition | KONISHI CO., LTD. (JP) | 2008-11-11 | — | — | US | disclosed |
| EP-1788035-A1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | Konishi Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20060189736-A1 | Curable resin composition and cold-setting adhesive | KONISHI CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| EP-1652891-A1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-20060079605-A1 | Curing resin, method for producing same and curing resin composition | KONISHI CO., LTD. (JP) | 2006-04-13 | — | — | US | disclosed |
| EP-1616886-A1 | CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION | Konishi Co., Ltd. (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-20050182225-A1 | Curable resin composition | KONISHI CO. LTD (JP) | 2005-08-18 | — | — | US | disclosed |
| EP-1514903-A1 | CURABLE RESIN COMPOSITION | Konishi Co., Ltd. (JP) | 2005-03-16 | — | — | EP | disclosed |