SCHEMBL5573272

SCHEMBL5573272

[Cu].[Cu].[Ti].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL79664 1.00
SCHEMBL7576823 1.00
SCHEMBL28103093 1.00
SCHEMBL2789643 0.82
Water SCHEMBL21352610 0.82
SCHEMBL25319315 0.82
Charcoal, Activated SCHEMBL8100650 0.82
SCHEMBL21987931 0.82
SCHEMBL987194 0.82
Water SCHEMBL18554173 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100371484-C High conductive titanium copper and its producing method NIPPON MINING CO (JP) 2008-02-27 CN disclosed
US-7253519-B2 Chip packaging structure having redistribution layer with recess ADVANCED SEMICONDUCTOR ENGINEERING, INC. (TW) 2007-08-07 US disclosed
CN-1279196-C Copper alloy NIPPON MINING CO (JP) 2006-10-11 CN disclosed
CN-1534102-A High conductive titanium copper and its producing method ���տ���ʽ���� 2004-10-06 CN disclosed
CN-1506476-A Copper alloy 日矿金属加工株式会社 2004-06-23 CN disclosed