Formic Acid

Formic Acid

SCHEMBL5574492

CCCC[N+](C)(C)C.O=C[O-]

nearest known ligand 0.55

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 8/20 0.55
APAF1 O14727 1/20 0.50
HSP90AA1 P07900 1/20 0.50
RAD52 P43351 1/20 0.50
MEN1 O00255 4/20 0.43
KMT2A Q03164 4/20 0.43
APEX1 P27695 3/20 0.43
LMNA P02545 3/20 0.43
NFKB1 P19838 2/20 0.43
KDM4E B2RXH2 2/20 0.43
ACHE P22303 2/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
PMP22 Q01453 2/20 0.43
HSD17B10 Q99714 1/20 0.43
HRH3 Q9Y5N1 1/20 0.43
TSHR P16473 1/20 0.43
RAB9A P51151 1/20 0.43
NPSR1 Q6W5P4 1/20 0.41
SLC22A1 O15245 1/20 0.41
BBOX1 O75936 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formic Acid SCHEMBL5574431 0.92 DNM1 (0.67) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL558268 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Cetrimonium SCHEMBL4817922 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL5570526 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL5573603 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL5573596 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL5573542 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL2533288 0.90 DNM1 (0.71) DNM1APAF1HSP90AA1RAD52MEN1
Formic Acid SCHEMBL5574500 0.84 DNM1 (0.55) DNM1APAF1HSP90AA1RAD52MEN1
Tributylmethylammonium SCHEMBL557487 0.84 SLC22A1 (0.41) DNM1KMT2ATSHRSLC22A1BBOX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2638123-B1 WORKING MEDIUM FOR ABSORPTION HEAT PUMPS EVONIK DEGUSSA GMBH (DE) 2016-08-31 EP claimed
US-20130219949-A1 WORKING MEDIUM FOR ABSORPTION HEAT PUMPS EVONIK DEGUSSA GMBH (DE) 2013-08-29 US claimed
US-20130219949-A1 WORKING MEDIUM FOR ABSORPTION HEAT PUMPS EVONIK DEGUSSA GMBH (DE) 2013-08-29 US disclosed
US-20070135565-A1 COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2007-06-14 US disclosed
US-7132473-B2 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2006-11-07 US disclosed
EP-1568744-A1 COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2005-08-31 EP disclosed
US-20040219372-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-11-04 US disclosed