SCHEMBL5574587

SCHEMBL5574587

C=CC[SiH2]OC(CC)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5570781 0.87
SCHEMBL5574623 0.84 TSHR (0.33)
SCHEMBL5574603 0.82
SCHEMBL28013562 0.77 TSHR (0.35)
SCHEMBL10923828 0.76
SCHEMBL5574613 0.76 TSHR (0.32)
SCHEMBL5573960 0.75
SCHEMBL5572081 0.74 TSHR (0.33)
SCHEMBL2283569 0.73 THRB (0.42)
SCHEMBL15158063 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108513626-A Dispersion liquid, coating fluid and heat ray shielding film 住友大阪水泥株式会社 2018-09-07 CN disclosed
US-7169327-B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2007-01-30 US disclosed
EP-1387367-A1 COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF JSR Corporation (JP) 2004-02-04 EP disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed