SCHEMBL5575133

SCHEMBL5575133

CCCC[SiH2]OC(CC)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5573920 0.91 TSHR (0.36)
SCHEMBL5573935 0.91
SCHEMBL28199568 0.91 TSHR (0.36)
SCHEMBL5575101 0.91 TSHR (0.36)
SCHEMBL704055 0.90
SCHEMBL705348 0.90
SCHEMBL5575087 0.89 PRKCA (0.33)
SCHEMBL3242423 0.87
SCHEMBL3231684 0.87
SCHEMBL3236531 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101641767-B Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device FUJITSU LTD 2013-10-30 CN disclosed
US-7169327-B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2007-01-30 US disclosed
EP-1566368-A2 Glass powder-containing resin composition, transfer film and process for manufacturing a plasma display panel comprising the transfer film JSR Corporation (JP) 2005-08-24 EP disclosed
EP-1387367-A1 COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF JSR Corporation (JP) 2004-02-04 EP disclosed
CN-1455933-A Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof JSR CORP (JP) 2003-11-12 CN disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed