⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2297212 | 0.89 | — | — | |
| SCHEMBL28011926 | 0.89 | — | — | |
| SCHEMBL29265631 | 0.89 | — | — | |
| SCHEMBL5407170 | 0.89 | — | — | |
| Water SCHEMBL10659100 | 0.89 | — | — | |
| SCHEMBL28365826 | 0.89 | — | — | |
| SCHEMBL16243880 | 0.89 | — | — | |
| SCHEMBL27996922 | 0.89 | — | — | |
| SCHEMBL4349083 | 0.89 | — | — | |
| SCHEMBL5447895 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1769 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260068205-A1 | METHOD FOR FORMING SEMICONDUCTOR DEVICE | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2026-03-05 | — | — | US | claimed |
| US-12525485-B2 | Gate contact structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-01-13 | — | — | US | claimed |
| US-12495606-B2 | Gate isolation structure | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2025-12-09 | — | — | US | claimed |
| US-12484241-B2 | Method for forming semiconductor device | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-11-25 | — | — | US | claimed |
| US-20250344434-A1 | BACKSIDE CONTACT | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-11-06 | — | — | US | claimed |
| US-20250329581-A1 | SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-10-23 | — | — | US | claimed |
| US-20250323110-A1 | MEMORY CELL SEALANT MATERIAL IN A THREE-DIMENSIONAL MEMORY ARRAY | MICRON TECHNOLOGY INC (US) | 2025-10-16 | — | — | US | claimed |
| US-12444674-B2 | Back-end-of-line passive device structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-10-14 | — | — | US | claimed |
| US-20250311265-A1 | DIELECTRIC ISOLATION STRUCTURE FOR MULTI-GATE TRANSISTORS | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-10-02 | — | — | US | claimed |
| US-12402407-B2 | Gap-insulated semiconductor device | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-08-26 | — | — | US | claimed |
| US-20050189598-A1 | Logic embedded-memory integrated circuits | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2005-09-01 | — | — | US | claimed |
| US-20050151211-A1 | Semiconductor device, and method and apparatus for manufacturing the same | FUJITSU LIMITED (JP) | 2005-07-14 | — | — | US | claimed |
| US-6696332-B2 | Bilayer deposition to avoid unwanted interfacial reactions during high K gate dielectric processing | TEXAS INSTRUMENTS INCORPORATED | 2004-02-24 | — | — | US | claimed |
| US-20030116804-A1 | Bilayer deposition to avoid unwanted interfacial reactions during high K gate dielectric processing | TEXAS INSTRUMENTS INCORPORATED | 2003-06-26 | — | — | US | claimed |
| CN-1104287-C | Ejector with one or several pockets | MAGOTTEAUX INT (BE) | 2003-04-02 | — | — | CN | claimed |
| US-6448192-B1 | Method for forming a high dielectric constant material | MOTOROLA, INC. | 2002-09-10 | — | — | US | claimed |
| US-6395650-B1 | Methods for forming metal oxide layers with enhanced purity | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-05-28 | — | — | US | claimed |
| CN-1293595-A | Ejector with one or more grooves | MAGOTTEAUX INT (BE) | 2001-05-02 | — | — | CN | claimed |
| CN-1244912-A | Co-compression molding method for producing non-fired or non-coked refractory | NORTH AMERICAN REFRACTORY CO (US) | 2000-02-16 | — | — | CN | claimed |
| CN-1019957-C | Alumina-zirconia-carbide whisker reinforced cutting tool | KENNAMETAL INC (US) | 1993-03-03 | — | — | CN | claimed |