⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL314498 | 0.77 | — | — | |
| SCHEMBL5580697 | 0.77 | — | — | |
| SCHEMBL331353 | 0.75 | — | — | |
| SCHEMBL5414801 | 0.75 | — | — | |
| SCHEMBL21403436 | 0.75 | — | — | |
| SCHEMBL7612472 | 0.74 | — | — | |
| SCHEMBL1818838 | 0.73 | — | — | |
| SCHEMBL26982663 | 0.73 | — | — | |
| Methylamine SCHEMBL28360677 | 0.71 | — | — | |
| SCHEMBL5404837 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5468826-A | Containing silicon-bonded hydrolyzable groups or hydrogen atoms, epoxy or methacrloyloxy groups; adhesives, protective coatings, encapsulants for integrated circuts | DOW CORNING CORPORATION (US) | 1995-11-21 | — | — | US | claimed |
| EP-0682058-A2 | Adhesion promoting additives and curable organosiloxane compositions containing same | DOW CORNING CORPORATION (US) | 1995-11-15 | — | — | EP | claimed |
| CN-118271847-A | Room temperature curable organopolysiloxane composition for protecting electrical/electronic components | 陶氏东丽株式会社 | 2024-07-02 | — | — | CN | disclosed |
| EP-3500629-B1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | DOW TORAY CO LTD (JP) | 2024-01-31 | — | — | EP | disclosed |
| US-10851243-B2 | Room temperature curable organopolysiloxane composition for protecting electric/electronic parts | DOW TORAY CO., LTD. (JP) | 2020-12-01 | — | — | US | disclosed |
| EP-3500629-A1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | Dow Corning Toray Co., Ltd. (JP) | 2019-06-26 | — | — | EP | disclosed |
| US-20190177487-A1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | DOW CORNING TORAY CO., LTD. (JP) | 2019-06-13 | — | — | US | disclosed |
| WO-2018034222-A1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | DOW CORNING TORAY CO., LTD. (JP) | 2018-02-22 | — | — | WO | disclosed |
| US-20140227435-A1 | Method Of Protecting Transparent Nonmetallic Electroconductive Parts | DOW CORNING TORAY CO., LTD. (JP) | 2014-08-14 | — | — | US | disclosed |
| EP-2707432-A1 | METHOD OF PROTECTING TRANSPARENT NONMETALLIC ELECTROCONDUCTIVE PARTS | Dow Corning Toray Co., Ltd. (JP) | 2014-03-19 | — | — | EP | disclosed |
| WO-2012157732-A1 | METHOD OF PROTECTING TRANSPARENT NONMETALLIC ELECTROCONDUCTIVE PARTS | DOW CORNING TORAY CO., LTD. (JP) | 2012-11-22 | — | — | WO | disclosed |
| EP-1127920-B1 | Curable silicone composition | DOW CORNING TORAY CO LTD (JP) | 2007-10-31 | — | — | EP | disclosed |
| EP-1584659-A2 | Curable silicone composition | Dow Corning Toray Silicone Company, Ltd. (JP) | 2005-10-12 | — | — | EP | disclosed |
| EP-0985710-B1 | Curable silicone composition | DOW CORNING TORAY SILICONE (JP) | 2003-09-24 | — | — | EP | disclosed |
| US-6297305-B1 | POLYSILOXANE WITH AT LEAST 2 ALKOXY GROUPS, POLYSILOXANE WITH AT LEAST 2 VINYL GROUPS, POLYSILOXANE WITH AT LEAST 2 HYDROGEN GROUPS, CONDENSATION REACTION CATALYST, PLATINUM TYPE CATALYST, AND AIR-OXIDATION-CURABLE UNSATURATED COMPOUND. | DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) | 2001-10-02 | — | — | US | disclosed |
| EP-1127920-A1 | Curable silicone composition | Dow Corning Toray Silicone Company, Ltd. (JP) | 2001-08-29 | — | — | EP | disclosed |
| EP-0985710-A1 | Curable silicone composition | Dow Corning Toray Silicone Company, Ltd. (JP) | 2000-03-15 | — | — | EP | disclosed |
| EP-0818520-A2 | Method for manufacturing bonded structure | Dow Corning Toray Silicone Co., Ltd. (JP) | 1998-01-14 | — | — | EP | disclosed |