Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5581195 | 0.83 | LMNA (0.38) | LMNA | |
| SCHEMBL35673 | 0.80 | LMNA (0.39) | LMNA | |
| SCHEMBL22092444 | 0.80 | LMNA (0.39) | LMNA | |
| SCHEMBL15049910 | 0.77 | LMNA (0.37) | LMNA | |
| SCHEMBL5580698 | 0.77 | — | — | |
| SCHEMBL17175683 | 0.77 | LMNA (0.31) | LMNA | |
| SCHEMBL4356594 | 0.77 | LMNA (0.31) | LMNA | |
| SCHEMBL331354 | 0.75 | LMNA (0.33) | LMNA | |
| SCHEMBL21403438 | 0.75 | LMNA (0.33) | LMNA | |
| SCHEMBL5412636 | 0.75 | LMNA (0.33) | LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5468826-A | Containing silicon-bonded hydrolyzable groups or hydrogen atoms, epoxy or methacrloyloxy groups; adhesives, protective coatings, encapsulants for integrated circuts | DOW CORNING CORPORATION (US) | 1995-11-21 | — | — | US | claimed |
| EP-0682058-A2 | Adhesion promoting additives and curable organosiloxane compositions containing same | DOW CORNING CORPORATION (US) | 1995-11-15 | — | — | EP | claimed |
| CN-118271847-A | Room temperature curable organopolysiloxane composition for protecting electrical/electronic components | 陶氏东丽株式会社 | 2024-07-02 | — | — | CN | disclosed |
| EP-3500629-B1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | DOW TORAY CO LTD (JP) | 2024-01-31 | — | — | EP | disclosed |
| US-10851243-B2 | Room temperature curable organopolysiloxane composition for protecting electric/electronic parts | DOW TORAY CO., LTD. (JP) | 2020-12-01 | — | — | US | disclosed |
| EP-3500629-A1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | Dow Corning Toray Co., Ltd. (JP) | 2019-06-26 | — | — | EP | disclosed |
| US-20190177487-A1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | DOW CORNING TORAY CO., LTD. (JP) | 2019-06-13 | — | — | US | disclosed |
| WO-2018034222-A1 | ROOM TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR PROTECTING ELECTRIC/ELECTRONIC PARTS | DOW CORNING TORAY CO., LTD. (JP) | 2018-02-22 | — | — | WO | disclosed |
| US-20140227435-A1 | Method Of Protecting Transparent Nonmetallic Electroconductive Parts | DOW CORNING TORAY CO., LTD. (JP) | 2014-08-14 | — | — | US | disclosed |
| EP-2707432-A1 | METHOD OF PROTECTING TRANSPARENT NONMETALLIC ELECTROCONDUCTIVE PARTS | Dow Corning Toray Co., Ltd. (JP) | 2014-03-19 | — | — | EP | disclosed |
| WO-2012157732-A1 | METHOD OF PROTECTING TRANSPARENT NONMETALLIC ELECTROCONDUCTIVE PARTS | DOW CORNING TORAY CO., LTD. (JP) | 2012-11-22 | — | — | WO | disclosed |
| EP-1231242-A1 | Curable organosiloxane compositions and semiconductor devices | Dow Corning Toray Silicone Company Ltd. (JP) | 2002-08-14 | — | — | EP | disclosed |
| US-6297305-B1 | POLYSILOXANE WITH AT LEAST 2 ALKOXY GROUPS, POLYSILOXANE WITH AT LEAST 2 VINYL GROUPS, POLYSILOXANE WITH AT LEAST 2 HYDROGEN GROUPS, CONDENSATION REACTION CATALYST, PLATINUM TYPE CATALYST, AND AIR-OXIDATION-CURABLE UNSATURATED COMPOUND. | DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) | 2001-10-02 | — | — | US | disclosed |
| EP-1127920-A1 | Curable silicone composition | Dow Corning Toray Silicone Company, Ltd. (JP) | 2001-08-29 | — | — | EP | disclosed |
| EP-0985710-A1 | Curable silicone composition | Dow Corning Toray Silicone Company, Ltd. (JP) | 2000-03-15 | — | — | EP | disclosed |
| US-5804631-A | CURING A MIXTURE OF AN ALKOXY-SUBSTITUTED ORGANOPOLYSILOXANE, AN ALKENYL-SUBSTITUTED ORGANOPOLYSILOXANE AND AN ORGANOPOLYSILOXANE WITH AT LEAST TWO SILICON-BONDED HYDROGEN ATOMS | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1998-09-08 | — | — | US | disclosed |
| EP-0818520-A2 | Method for manufacturing bonded structure | Dow Corning Toray Silicone Co., Ltd. (JP) | 1998-01-14 | — | — | EP | disclosed |
| US-5684110-A | Silicone rubber composition for formed-in-place gaskets | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1997-11-04 | — | — | US | disclosed |
| EP-0757080-A2 | Curable organosiloxane compositions and semiconductor devices | Dow Corning Toray Silicone Company Ltd. (JP) | 1997-02-05 | — | — | EP | disclosed |
| EP-0752450-A1 | Silicone rubber composition for formed-in-place gaskets | Dow Corning Toray Silicone Company Ltd. (JP) | 1997-01-08 | — | — | EP | disclosed |