Nonanoate

Nonanoate

SCHEMBL5590408

CCCCCCCCC(=O)[O-].CCCCCCCCC(=O)[O-].CCCCCCCCC(=O)[O-].CCCCCCCCC(=O)[O-].[Ti+4]

nearest known ligand 0.90

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
FABP3 P05413 7/20 0.72
CA1 P00915 1/20 0.71
CES2 O00748 4/20 0.67
CES1 P23141 4/20 0.67
FFAR3 O14843 1/20 0.57
HDAC3 O15379 1/20 0.57
HDAC1 Q13547 1/20 0.57
HDAC2 Q92769 1/20 0.57
HDAC8 Q9BY41 1/20 0.57
NFKB1 P19838 1/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Palmitic Acid SCHEMBL31171895 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Decanoic Acid SCHEMBL8385435 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Stearic Acid SCHEMBL18258677 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Dodecanoate SCHEMBL2140158 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Stearic Acid SCHEMBL428882 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Dodecanoate SCHEMBL914943 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Undecanoate SCHEMBL17536058 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Octanoic Acid SCHEMBL848569 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Stearic Acid SCHEMBL2139949 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3
Heptanoate SCHEMBL17091706 1.00 FABP3 (0.72) FABP3CA1CES2CES1FFAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115768832-A Resin composition, method for producing same, and method for producing composition for pattern formation 富士胶片株式会社 2023-03-07 CN disclosed
CN-115755526-A Photosensitive resin composition and method for producing cured relief pattern 旭化成株式会社 2023-03-07 CN disclosed
CN-115729037-A Cured product, laminate, semiconductor device, method for producing same, resin composition, and compound 富士胶片株式会社 2023-03-03 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-114761466-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-15 CN disclosed
CN-114730132-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-08 CN disclosed
EP-1645917-B1 Process cartridge, image forming method, and image forming apparatus on a photosensitive drum with a metallic coating RICOH CO LTD (JP) 2016-11-30 EP disclosed
US-7274898-B2 Process cartridge, image forming method, and image forming apparatus RICOH COMPANY, LTD. (JP) 2007-09-25 US disclosed
EP-1645917-A2 Process cartridge, image forming method, and image forming apparatus on a photosensitive drum with a metallic coating Ricoh Company, Ltd. (JP) 2006-04-12 EP disclosed
US-20060062595-A1 Process cartridge, image forming method, and image forming apparatus RICOH COMPANY, LTD. (JP) 2006-03-23 US disclosed