SCHEMBL5595879

SCHEMBL5595879

CC(C)=CCC/C(C)=C/CCC(C)(C)O

nearest known ligand 0.68

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 4/20 0.68
KMT2A Q03164 3/20 0.64
MAPT P10636 2/20 0.57
MEN1 O00255 2/20 0.57
CYP3A4 P08684 2/20 0.57
ALDH1A1 P00352 1/20 0.57
UGT1A1 P22309 1/20 0.57
SQLE Q14534 7/20 0.55
KDM4E B2RXH2 1/20 0.52
GGPS1 O95749 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5595884 1.00 ALOX15 (0.68) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL583687 0.87 ALOX15 (0.60) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL18686407 0.86 KMT2A (0.63) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL16618409 0.84 ALOX15 (0.64) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL16618412 0.84 ALOX15 (0.64) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL8623650 0.83 KMT2A (0.64) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL28674475 0.83 KMT2A (0.64) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL871913 0.83 KMT2A (0.64) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL4653602 0.83 KMT2A (0.64) ALOX15KMT2AMAPTMEN1CYP3A4
SCHEMBL24002441 0.82 ALOX15 (0.62) ALOX15KMT2AMAPTMEN1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1422279-B1 Semiconductor package with a die attach adhesive having silane functionality NAT STARCH CHEM INVEST (US) 2007-04-04 EP disclosed
US-6784025-B2 Semiconductor package with a die attach adhesive having silane functionality NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION 2004-08-31 US disclosed
US-20040097014-A1 SEMICONDUCTOR PACKAGE WITH A DIE ATTACH ADHESIVE HAVING SILANE FUNCTIONALITY HENKEL AG & CO. KGAA (DE) 2004-05-20 US disclosed