⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL432325 | 0.87 | — | — | |
| SCHEMBL11795835 | 0.77 | — | — | |
| SCHEMBL13773192 | 0.77 | — | — | |
| SCHEMBL16581442 | 0.70 | — | — | |
| SCHEMBL13773206 | 0.70 | — | — | |
| SCHEMBL13773196 | 0.70 | — | — | |
| SCHEMBL13773200 | 0.70 | — | — | |
| SCHEMBL4891102 | 0.70 | — | — | |
| SCHEMBL4455263 | 0.67 | SHBG (0.30) | — | |
| SCHEMBL12201001 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20160369058-A1 | DUAL MODALITIES CURING SILICONE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. | 2016-12-22 | — | — | US | claimed |
| EP-3019152-A1 | DUAL MODALITIES CURING SILICONE COMPOSITIONS | Momentive Performance Materials Inc. (US) | 2016-05-18 | — | — | EP | claimed |
| CN-105517534-A | Dual modalities curing silicone compositions | MOMENTIVE PERFORMANCE MAT INC | 2016-04-20 | — | — | CN | claimed |
| WO-2015006531-A1 | DUAL MODALITIES CURING SILICONE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2015-01-15 | — | — | WO | claimed |
| US-20160369058-A1 | DUAL MODALITIES CURING SILICONE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. | 2016-12-22 | — | — | US | disclosed |
| EP-3019152-A1 | DUAL MODALITIES CURING SILICONE COMPOSITIONS | Momentive Performance Materials Inc. (US) | 2016-05-18 | — | — | EP | disclosed |
| CN-105517534-A | Dual modalities curing silicone compositions | MOMENTIVE PERFORMANCE MAT INC | 2016-04-20 | — | — | CN | disclosed |
| WO-2015006531-A1 | DUAL MODALITIES CURING SILICONE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2015-01-15 | — | — | WO | disclosed |
| US-20070225465-A1 | Composition for Sealing Optical Semiconductor, Optical Semiconductor Sealing Material, and Method for Producing Composition for Sealing Optical Semiconductor | JSR CORPORATION (JP) | 2007-09-27 | — | — | US | disclosed |
| EP-1736500-A1 | COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND METHOD FOR PRODUCING COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR | JSR Corporation (JP) | 2006-12-27 | — | — | EP | disclosed |