SCHEMBL5607872

SCHEMBL5607872

C=CC(=O)OC(Br)(Br)c1cccc(Br)c1Br

nearest known ligand 0.34

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.34
TAS2R14 Q9NYV8 1/20 0.33
HSD11B1 P28845 1/20 0.32
TGM2 P21980 1/20 0.31
TYMS P04818 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5607043 0.87 THRB (0.39) THRBTAS2R14HSD11B1TGM2
SCHEMBL130272 0.85 THRB (0.32) THRB
SCHEMBL29577536 0.83 THRB (0.43) THRBTGM2
Acrylic Acid SCHEMBL3135012 0.81 THRB (0.33) THRB
Toluene SCHEMBL29216420 0.79 THRB (0.35) THRB
SCHEMBL8678381 0.79 KCNK3 (0.38) THRB
SCHEMBL8040204 0.78
SCHEMBL8026689 0.76 GSR (0.31) THRB
SCHEMBL9416560 0.76
SCHEMBL11403631 0.74 CA1 (0.37) THRBTAS2R14HSD11B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4169977-B1 RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI CHEM CORP (JP) 2026-03-18 EP disclosed
US-12559623-B2 Resin composition and electromagnetic wave absorber MITSUBISHI CHEMICAL CORPORATION (JP) 2026-02-24 US disclosed
EP-3889214-B1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI CHEM CORP (JP) 2025-08-13 EP disclosed
WO-2025075169-A1 RESIN COMPOSITION, PELLET, AND MOLDED ARTICLE 三菱ケミカル株式会社 2025-04-10 WO disclosed
WO-2025033540-A1 RESIN COMPOSITION, PELLET, MOLDED ARTICLE, AND METHOD FOR SUPPRESSING DISCOLORATION 三菱ケミカル株式会社 2025-02-13 WO disclosed
WO-2025033541-A1 RESIN COMPOSITION, PELLETS, AND MOLDED ARTICLE 三菱ケミカル株式会社 2025-02-13 WO disclosed
EP-3770217-B1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION POLYPLASTICS CO (JP) 2025-02-12 EP disclosed
US-20250002701-A9 RESIN COMPOSITION, FORMED ARTICLE , ELECTROMAGNETIC WAVE ABSORBER, AND METHOD FOR MEASURING ABSORBANCE OF RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2025-01-02 US disclosed
EP-4442764-A1 RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE, AND METAL/RESIN COMPOSITE Mitsubishi Chemical Corporation (JP) 2024-10-09 EP disclosed
US-20240327670-A1 RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE, AND METAL-RESIN COMPOSITE MITSUBISHI CHEMICAL CORPORATION (JP) 2024-10-03 US disclosed
EP-1225202-B1 FLAME-RETARDANT POLYESTER RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND METHOD OF MOLDING THE SAME TEIJIN LTD (JP) 2005-11-23 EP disclosed
US-6627690-B1 Brominated epoxy compound, brominated polyacrylate, and antimony trioxide TEIJIN LIMITED (JP) 2003-09-30 US disclosed
EP-1225202-A1 FLAME-RETARDANT POLYESTER RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND METHOD OF MOLDING THE SAME TEIJIN LIMITED (JP) 2002-07-24 EP disclosed
EP-0667372-B1 Polyester resin composition and a relay component formed thereof TEIJIN LTD (JP) 2001-05-16 EP disclosed
US-6136915-A HEAT RESISTANT POLYHEXAMETHYLENE (ADIPAMIDE AND/OR TEREPHTHALAMIDE) UBE INDUSTRIES, LTD. (JP) 2000-10-24 US disclosed
EP-0934979-A2 Partly aromatic polyamide resins compositions Ube Industries, Ltd. (JP) 1999-08-11 EP disclosed
US-5814696-A AROMATIC POLYESTER BLENDS COMPRISING A POLYESTER BLOCK COPOLYMER WITH SOFT BLOCK AND HARD BLOCK EXCELLENT VIBRATION-DAMPING AND NOISE SUPPRESSION; TENSILE STRENGTH, IMPACT STRENGTH, HEAT RESISTANCE TEIJIN LIMITED (JP) 1998-09-29 US disclosed
EP-0667372-A1 Polyester resin composition and a relay component formed thereof TEIJIN LIMITED (JP) 1995-08-16 EP disclosed
EP-0622414-A1 FLAME-RETARDANT POLYESTER RESIN COMPOSITION TEIJIN LIMITED (JP) 1994-11-02 EP disclosed
US-4454302-A BLEND WITH HALOGEN CONTAINING ACRYLIC RESIN MITSUBISHI CHEMICAL INDUSTRIES LTD. (JP) 1984-06-12 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12559623-B2 Resin composition and electromagnetic wave absorber TERB1, LBR, TEX10 THRB 722/4885TAS2R14 491/4885HSD11B1 3195/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.