SCHEMBL5607873

SCHEMBL5607873

C=CC(=O)OC(Br)c1ccc(Br)c(Br)c1Br

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5607045 0.86 CYP2C9 (0.33)
SCHEMBL251364 0.84 EIF2AK2 (0.33)
SCHEMBL1153651 0.79 CYP2C19 (0.37)
SCHEMBL8678384 0.77 BCHE (0.34)
SCHEMBL27700965 0.76 KMT2A (0.31)
SCHEMBL2794002 0.74 TSHR (0.31)
SCHEMBL351498 0.71 TSHR (0.31)
SCHEMBL2362357 0.69 CES2 (0.44)
SCHEMBL30596831 0.69 TYMS (0.42)
SCHEMBL331642 0.69 TYMS (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4169977-B1 RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI CHEM CORP (JP) 2026-03-18 EP disclosed
US-12559623-B2 Resin composition and electromagnetic wave absorber MITSUBISHI CHEMICAL CORPORATION (JP) 2026-02-24 US disclosed
EP-3889214-B1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI CHEM CORP (JP) 2025-08-13 EP disclosed
WO-2025075169-A1 RESIN COMPOSITION, PELLET, AND MOLDED ARTICLE 三菱ケミカル株式会社 2025-04-10 WO disclosed
WO-2025033540-A1 RESIN COMPOSITION, PELLET, MOLDED ARTICLE, AND METHOD FOR SUPPRESSING DISCOLORATION 三菱ケミカル株式会社 2025-02-13 WO disclosed
WO-2025033541-A1 RESIN COMPOSITION, PELLETS, AND MOLDED ARTICLE 三菱ケミカル株式会社 2025-02-13 WO disclosed
EP-3770217-B1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION POLYPLASTICS CO (JP) 2025-02-12 EP disclosed
US-20250002701-A9 RESIN COMPOSITION, FORMED ARTICLE , ELECTROMAGNETIC WAVE ABSORBER, AND METHOD FOR MEASURING ABSORBANCE OF RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2025-01-02 US disclosed
EP-4442764-A1 RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE, AND METAL/RESIN COMPOSITE Mitsubishi Chemical Corporation (JP) 2024-10-09 EP disclosed
US-20240327670-A1 RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE, AND METAL-RESIN COMPOSITE MITSUBISHI CHEMICAL CORPORATION (JP) 2024-10-03 US disclosed
CN-1738713-A Laminated structure excellent in fuel permeation preventing performance UBE INDUSTRIES (JP) 2006-02-22 CN disclosed
EP-1614716-A1 Insulating parts Mitsubishi Engineering-Plastics Corporation (JP) 2006-01-11 EP disclosed
EP-1225202-B1 FLAME-RETARDANT POLYESTER RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND METHOD OF MOLDING THE SAME TEIJIN LTD (JP) 2005-11-23 EP disclosed
US-6627690-B1 Brominated epoxy compound, brominated polyacrylate, and antimony trioxide TEIJIN LIMITED (JP) 2003-09-30 US disclosed
EP-1225202-A1 FLAME-RETARDANT POLYESTER RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND METHOD OF MOLDING THE SAME TEIJIN LIMITED (JP) 2002-07-24 EP disclosed
EP-0667372-B1 Polyester resin composition and a relay component formed thereof TEIJIN LTD (JP) 2001-05-16 EP disclosed
US-5814696-A AROMATIC POLYESTER BLENDS COMPRISING A POLYESTER BLOCK COPOLYMER WITH SOFT BLOCK AND HARD BLOCK EXCELLENT VIBRATION-DAMPING AND NOISE SUPPRESSION; TENSILE STRENGTH, IMPACT STRENGTH, HEAT RESISTANCE TEIJIN LIMITED (JP) 1998-09-29 US disclosed
EP-0667372-A1 Polyester resin composition and a relay component formed thereof TEIJIN LIMITED (JP) 1995-08-16 EP disclosed
EP-0622414-A1 FLAME-RETARDANT POLYESTER RESIN COMPOSITION TEIJIN LIMITED (JP) 1994-11-02 EP disclosed
US-4454302-A BLEND WITH HALOGEN CONTAINING ACRYLIC RESIN MITSUBISHI CHEMICAL INDUSTRIES LTD. (JP) 1984-06-12 US disclosed