Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2337511 | 0.86 | ALDH1A1 (0.48) | ALDH1A1CYP3A4 | |
| SCHEMBL2792302 | 0.85 | ALDH1A1 (0.50) | ALDH1A1CYP3A4 | |
| SCHEMBL12019112 | 0.78 | ALDH1A1 (0.65) | ALDH1A1CYP3A4 | |
| SCHEMBL14277128 | 0.76 | ALDH1A1 (0.44) | ALDH1A1CYP3A4 | |
| SCHEMBL3197954 | 0.73 | ALDH1A1 (0.59) | ALDH1A1CYP3A4 | |
| SCHEMBL28770436 | 0.72 | ALDH1A1 (0.57) | ALDH1A1CYP3A4 | |
| SCHEMBL24783183 | 0.71 | ALDH1A1 (0.65) | ALDH1A1CYP3A4 | |
| SCHEMBL14198783 | 0.69 | ALDH1A1 (0.73) | ALDH1A1CYP3A4 | |
| SCHEMBL264479 | 0.69 | ALDH1A1 (0.54) | ALDH1A1CYP3A4 | |
| SCHEMBL10816125 | 0.69 | ALDH1A1 (0.47) | ALDH1A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5707612-A | URETHANE FROM ISOPHORONE DIISOCYANATE AND TRIGLYCERIDE OF HYDROXYUNSATURATED ACID WITH ETHERS, ESTERS OR AMINES | ALZO, INC. (US) | 1998-01-13 | — | — | US | claimed |
| US-12024578-B2 | Curable composition | NITTO SHINKO CORPORATION (JP) | 2024-07-02 | — | — | US | disclosed |
| US-20230312811-A1 | CURABLE COMPOUND, CURABLE COMPOSITION, AND METHOD FOR PRODUCING CURABLE COMPOSITION | NITTO SHINKO CORPORATION (JP) | 2023-10-05 | — | — | US | disclosed |
| US-11773202-B2 | Curable compound, curable composition, and method for producing curable composition | NITTO SHINKO CORPORATION (JP) | 2023-10-03 | — | — | US | disclosed |
| EP-4186933-A1 | CURABLE COMPOUND, CURABLE COMPOSITION, AND METHOD FOR PRODUCING CURABLE COMPOSITION | Nitto Shinko Corporation (JP) | 2023-05-31 | — | — | EP | disclosed |
| US-20220396645-A1 | CURABLE COMPOSITION | NITTO SHINKO CORPORATION (JP) | 2022-12-15 | — | — | US | disclosed |
| EP-4041830-A1 | THERMALLY CURABLE TWO-COMPONENT COATING COMPOUNDS | BASF SE (DE) | 2022-08-17 | — | — | EP | disclosed |
| CN-114787213-A | Curable composition | 日东新兴有限公司 | 2022-07-22 | — | — | CN | disclosed |
| EP-3909993-A1 | CURABLE COMPOUND, CURABLE COMPOSITION, AND METHOD FOR PRODUCING CURABLE COMPOSITION | Nitto Shinko Corporation (JP) | 2021-11-17 | — | — | EP | disclosed |
| EP-3909992-A1 | CURABLE COMPOSITION | Nitto Shinko Corporation (JP) | 2021-11-17 | — | — | EP | disclosed |
| US-6673441-B1 | EPOXY RESIN, HARDENER, EPOXIDIZED ACRYLIC COPOLYMER HAVING GLYCIDYL (METH)ACRYLATE COMONOMER, AND LATENT CURING ACCELERATOR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-6607629-B2 | Low viscosity mixtue of a monomer and/or polymeric adhesive which is crosslinkable by ultraviolet or stronger electromagnetic radiation, useful in one-step or multistep perfect binding of books and other print articles | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 2003-08-19 | — | — | US | disclosed |
| US-20030145949-A1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | TANAKA YUKO (JP) | 2003-08-07 | — | — | US | disclosed |
| US-20020157780-A1 | ADHESIVE SYSTEMS FOR A ONE OR MULTI STEP ADHESIVE BINDING METHOD, METHOD FOR ADHESIVE BINDING OF PRINTED MATTER | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) (DE) | 2002-10-31 | — | — | US | disclosed |
| EP-0940417-B1 | Electrically insulating, curable polyurethane compositions and electric or electronic device prepared therewith | SANYU REC CO LTD (JP) | 2002-07-31 | — | — | EP | disclosed |
| EP-1209211-A1 | ADHESIVE, ADHESIVE MEMBER, CIRCUIT SUBSTRATE FOR SEMICONDUCTOR MOUNTING HAVING ADHESIVE MEMBER, AND SEMICONDUCTOR DEVICE CONTAINING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-05-29 | — | — | EP | disclosed |
| US-5958594-A | FOR COATING ELECTRIC OR ELECTRONIC PARTS OR DEVICES TO SEAL THE SAME AND WHICH CAN GIVE FLEXIBLE CURING PRODUCTS EXCELLENT IN HEAT RESISTANCE, HYDROLYSIS RESISTANCE (WET HEAT RESISTANCE) AND MOISTUREPROOFNESS | SAN-YU RESIN KABUSHIKI KAISHA (JP) | 1999-09-28 | — | — | US | disclosed |
| EP-0940417-A1 | Electrically insulating, curable polyurethane compositions and electric or electronic device made therewith | San-yu Resin Kabushiki Kaisha (JP) | 1999-09-08 | — | — | EP | disclosed |
| US-5344851-A | Process for recovering binder components from lacquer sludge | BAYER AKTIENGESELLSCHAFT (DE) | 1994-09-06 | — | — | US | disclosed |
| US-4009307-A | Polyurea-urethane coatings | PPG INDUSTRIES, INC. (US) | 1977-02-22 | — | — | US | disclosed |